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TM16EN64HPU-40 PDF预览

TM16EN64HPU-40

更新时间： 2024-09-24 21:16:43
品牌 Logo 应用领域
德州仪器 - TI 动态存储器内存集成电路
页数 文件大小 规格书
21页 314K
描述
16MX64 EDO DRAM MODULE, 20ns, DMA168, DIMM-168

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中文翻译

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TM16EN64HPU-40 技术参数

生命周期：Obsolete零件包装代码：DIMM
包装说明：DIMM, DIMM168针数：168
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8542.32.00.32风险等级：5.84
访问模式：FAST PAGE WITH EDO最长访问时间：20 ns
其他特性：RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESHI/O 类型：COMMON
JESD-30 代码：R-XDMA-N168内存密度：1073741824 bit
内存集成电路类型：EDO DRAM MODULE内存宽度：64
功能数量：1端口数量：1
端子数量：168字数：16777216 words
字数代码：16000000工作模式：ASYNCHRONOUS
最高工作温度：70 °C最低工作温度：
组织：16MX64输出特性：3-STATE
封装主体材料：UNSPECIFIED封装代码：DIMM
封装等效代码：DIMM168封装形状：RECTANGULAR
封装形式：MICROELECTRONIC ASSEMBLY电源：3.3 V
认证状态：Not Qualified刷新周期：4096
最大待机电流：0.008 A子类别：DRAMs
最大压摆率：2.56 mA最大供电电压 (Vsup)：3.6 V
最小供电电压 (Vsup)：3 V标称供电电压 (Vsup)：3.3 V
表面贴装：NO技术：CMOS
温度等级：COMMERCIAL端子形式：NO LEAD
端子节距：1.27 mm端子位置：DUAL
Base Number Matches：1

TM16EN64HPU-40 数据手册

 浏览型号TM16EN64HPU-40的Datasheet PDF文件第2页浏览型号TM16EN64HPU-40的Datasheet PDF文件第3页浏览型号TM16EN64HPU-40的Datasheet PDF文件第4页浏览型号TM16EN64HPU-40的Datasheet PDF文件第5页浏览型号TM16EN64HPU-40的Datasheet PDF文件第6页浏览型号TM16EN64HPU-40的Datasheet PDF文件第7页 
TM16EN64HPU, TM16EN64LPU 16777216 BY 64-BIT  
TM16EN72HPU, TM16EN72LPU 16777216 BY 72-BIT  
EXTENDED-DATA-OUT DYNAMIC RAM MODULES  
SMMS695A – AUGUST 1997 – REVISED NOVEMBER 1997  
Organization  
Long Refresh Periods:  
– TM16EN64xPU-xx . . . 16777216 × 64 Bits  
– TM16EN72xPU-xx . . . 16777216 × 72 Bits  
– TM16ENxxHPU: 64 ms (4096 Cycles)  
– TM16ENxxLPU: 64 ms (8192 Cycles)  
Single 3.3-V Power Supply  
3-State Output  
(±10% Tolerance)  
Extended-Data-Out (EDO) Operation With  
CAS-Before-RAS (CBR), RAS-Only, and  
Hidden Refresh  
JEDEC 168-Pin Dual-In-Line Memory  
Module (DIMM) Without Buffer for Use With  
Socket  
Serial Presence-Detect (SPD) Using  
EEPROM  
TM16EN64HPUxx — Utilizes Sixteen  
64M-Bit High-Speed (16M×4-Bit) Dynamic  
RAMs  
Ambient Temperature Range  
0°C to 70°C  
TM16EN72HPUxx — Utilizes Eighteen  
64M-Bit High-Speed (16M×4-Bit) Dynamic  
RAMs  
Gold-Plated Contacts  
Performance Ranges  
ACCESS ACCESS ACCESS EDO  
High-Speed, Low-Noise LVTTL Interface  
TIME  
TIME  
TIME CYCLE  
High-Reliability 32-Lead 300-Mil-Wide  
Surface-Mount Thin Small-Outline Package  
(TSOP) (DGC Suffix)  
t
t
t
t
HPC  
RAC  
CAC  
AA  
(MAX)  
’16ENxxxPU-40 40 ns  
’16ENxxxPU-50 50 ns  
’16ENxxxPU-60 60 ns  
(MAX)  
11 ns  
13 ns  
15 ns  
(MAX)  
20 ns  
25 ns  
30 ns  
(MIN)  
16 ns  
20 ns  
25 ns  
description  
The TM16EN64HPU is a 128M-byte, 168-pin, dual-in-line memory module (DIMM). The DIMM is composed  
of sixteen TMS465409, 16777216 × 4-bit 4K-refresh EDO dynamic random-access memories (DRAMs), each  
in a 400-mil, 32-pin plastic thin small-outline package (TSOP) (DGC suffix) mounted on a substrate with  
decoupling capacitors. See the TMS465409 data sheet (literature number SMKS895).  
The TM16EN64LPU is a 128M-byte, 168-pin DIMM. The DIMM is composed of eighteen TMS464409,  
16777216 × 4-bit 8K-refresh EDO dynamic random-access memories (DRAMs), each in a 400-mil, 32-pin  
plastic TSOP (DGC suffix) mounted on a substrate with decoupling capacitors. See the TMS465409 data sheet  
(literature number SMKS895).  
The TM16EN72HPU is a 128M-byte, 168-pin DIMM. The DIMM is composed of eighteen TMS465409,  
16777216 × 4-bit 4K-refresh EDO dynamic random-access memories (DRAMs), each in a 400-mil, 32-pin  
plastic TSOP (DGC suffix) mounted on a substrate with decoupling capacitors. See the TMS465409 data sheet  
(literature number SMKS895).  
TheTM16EN72LPUisa128M-byte, 168-pinDIMM. TheDIMMiscomposedofeighteenTMS464409, 4194309  
× 4-bit 8K-refresh EDO dynamic random-access memories (DRAMs), each in a 400-mil, 32-pin plastic TSOP  
(DGC suffix) mounted on a substrate with decoupling capacitors. See the TMS465409 data sheet (literature  
number SMKS895).  
operation  
The TM16EN64xPU operates as sixteen TMS46x409s that are connected as shown in the TM16EN64xPU  
functional block diagram. The TM16EN72xPU operates as eighteen TMS46x409s that are connected as shown  
in the TM16EN72xPU functional block diagram.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
1
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443  
1234567...21

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