Datasheet > TM16ER72LP

TM16ER72LP

更新时间： 2024-09-25 02:58:35

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德州仪器 - TI		/
页数	文件大小	规格书
14页	251K
描述
SYNCHRONOUS DYNAMIC RAM MODULES

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TM16ER72LP 数据手册

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SMMS694 − AUGUST 1997

Organization

− TM16ER72HP-xx . . . 16777216 × 72 Bits

− TM16ER72LP-xx . . . 16777216 × 72 Bits

Long Refresh Periods:

− TM16ER72HP: 64 ms (4096 Cycles)

− TM16ER72LP: 64 ms (8192 Cycles)

Single 3.3-V Power Supply

( 10% Tolerance)

3-State Output

Extended-Data-Out (EDO) Operation With

CAS-Before-RAS (CBR), RAS-Only, and

Hidden Refresh

JEDEC 168-Pin Dual-In-Line Memory

Module (DIMM) With Buffer for Use With

Socket

Ambient Temperature Range

0°C to 70°C

Gold-Plated Contacts

TM16ER72xP-xx — Uses 18 64M-Bit

High-Speed (16M×4-Bit) Dynamic RAMs

High-Speed, Low-Noise LVTTL Interface

Performance Ranges

High-Reliability 32-Lead 400-Mil-Wide

Surface-Mount Thin Small-Outline Package

(TSOP) (DGE Suffix)

ACCESS ACCESS ACCESS EDO

TIME

TIME CYCLE

HPC

RAC

CAC

(MAX)

40 ns

50 ns

60 ns

(MAX)

11 ns

13 ns

15 ns

(MAX)

20 ns

25 ns

30 ns

(MIN)

16 ns

20 ns

25 ns

Intended for Workstation/Server

Applications

’16ER72xx-40

’16ER72xx-50

’16ER72xx-60

description

The TM16ER72HP is a 128M-byte, 168-pin, buffered dual-in-line memory module (DIMM). The DIMM is

composed of eighteen TMS465409, 16777216 × 4-bit 4K-refresh EDO dynamic random-access memories

(DRAMs), each in a 400-mil, 32-pin plastic thin small-outline package (TSOP) (DGE suffix), and two

SN74LVC162244 16-bit buffers, each in a 48-lead plastic TSOP package mounted on a substrate with

decoupling capacitors. See the TMS465409 data sheet (literature number SMKS895).

The TM16ER72LP is a 128M-byte, 168-pin, buffered DIMM. The DIMM is composed of eighteen TMS464409,

16777216 × 4-bit 8K-refresh EDO DRAMs, each in a 400-mil, 32-pin plastic TSOP (DGE suffix), and two

SN74LVC162244 16-bit buffers, each in a 48-lead plastic TSOP package mounted on a substrate with

decoupling capacitors. See the TMS465409 data sheet (literature number SMKS895).

These modules are intended for multimodule workstation/server applications where buffering is needed for

address and control signals. Two copies of address 0 (A0 and B0) are defined to allow maximum performance

for 4-byte applications that interleave between two 4-byte banks. A0 is common to the DRAMs used for

DQ0−DQ31, while B0 is common to the DRAMs used for DQ32−DQ63.

operation

The TM16ER72xP operates as eighteen TMS46x409s that are connected as shown in the TM16ER72xP

functional block diagram.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443

12 3 4 5 6 7...14

中文翻译

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与TM16ER72LP相关器件

型号	品牌	获取价格	描述	数据表
TM16ER72LP-60	TI	获取价格	16MX72 EDO DRAM MODULE, 60ns, DMA168, DIMM-168
TM16IO	PANASONIC	获取价格	32-bit Single-chip Microcontroller
TM16LR64JFN	TI	获取价格	SYNCHRONOUS DYNAMIC RAM MODULES
TM16LR64JFN-8	TI	获取价格	16MX64 SYNCHRONOUS DRAM MODULE, 6ns, DMA168, DIMM-168
TM16PN0011	ITT	获取价格	Rack and Panel Connector, 16 Contact(s), Male, Plug
TM16PN0071	ITT	获取价格	Rack and Panel Connector, 16 Contact(s), Male, Plug
TM16PN1181	ITT	获取价格	Rack and Panel Connector, 16 Contact(s), Male, Plug
TM16PN1201	ITT	获取价格	Rack and Panel Connector, 16 Contact(s), Male, Plug
TM16PN1351	ITT	获取价格	Rack and Panel Connector, 16 Contact(s), Male, Plug
TM16PN1361	ITT	获取价格	Rack and Panel Connector, 16 Contact(s), Male, Plug

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