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TLV5638QDREP PDF预览

TLV5638QDREP

更新时间: 2024-01-23 11:25:57
品牌 Logo 应用领域
德州仪器 - TI 转换器数模转换器测试光电二极管
页数 文件大小 规格书
20页 626K
描述
Controlled Baseline One Assembly/Test Site, One Fabrication Site

TLV5638QDREP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:SOIC-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:1.38Is Samacsys:N
最大模拟输出电压:5.1 V最小模拟输出电压:
转换器类型:D/A CONVERTER输入位码:BINARY
输入格式:SERIALJESD-30 代码:R-PDSO-G8
JESD-609代码:e4长度:4.9 mm
最大线性误差 (EL):0.1465%湿度敏感等级:1
位数:12功能数量:1
端子数量:8最高工作温度:125 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP8,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260电源:3/5 V
认证状态:Not Qualified采样速率:0.233 MHz
座面最大高度:1.75 mm最大稳定时间:7 µs
标称安定时间 (tstl):1 µs子类别:Other Converters
最大压摆率:6.3 mA标称供电电压:3 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.91 mmBase Number Matches:1

TLV5638QDREP 数据手册

 浏览型号TLV5638QDREP的Datasheet PDF文件第2页浏览型号TLV5638QDREP的Datasheet PDF文件第3页浏览型号TLV5638QDREP的Datasheet PDF文件第4页浏览型号TLV5638QDREP的Datasheet PDF文件第5页浏览型号TLV5638QDREP的Datasheet PDF文件第6页浏览型号TLV5638QDREP的Datasheet PDF文件第7页 
ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢇꢈ ꢉ  
ꢊ ꢋ ꢌ ꢇꢂ ꢀꢍ ꢃ ꢋꢃ ꢇꢂ ꢁ ꢍ ꢎꢇꢉꢍ ꢎ ꢈꢏ ꢐꢑꢒ ꢁ ꢓ ꢊ ꢇꢔꢕ ꢀ ꢐꢕ ꢖꢕ ꢀꢒꢁ ꢇꢀꢍꢇ ꢒꢗ ꢒ ꢁꢍ ꢖ  
ꢘꢍ ꢗꢂ ꢈ ꢏꢀ ꢈꢏ ꢎ ꢕꢀ ꢙ ꢕꢗ ꢀꢈ ꢏꢗꢒꢁ ꢏꢈꢚ ꢈ ꢏꢈꢗꢘꢈ ꢒꢗꢐ ꢉꢍ ꢎꢈ ꢏ ꢐ ꢍꢎ ꢗ  
SGLS130B − JULY 2002 − REVISED DECEMBER 2003  
D
Compatible With TMS320 and SPISerial  
features  
Ports  
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
D
Differential Nonlinearity <0.5 LSB Typ  
Monotonic Over Temperature  
D
D
D
Extended Temperature Performance up to  
−55°C to 125°C  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
applications  
D
D
D
D
D
Digital Servo Control Loops  
Digital Offset and Gain Adjustment  
Industrial Process Control  
D
D
D
D
D
Enhanced Product Change Notification  
Qualification Pedigree  
Machine and Motion Control Devices  
Mass Storage Devices  
Dual 12-Bit Voltage Output DAC  
Programmable Internal Reference  
D PACKAGE  
(TOP VIEW)  
Programmable Settling Time:  
1 µs in Fast Mode,  
3.5 µs in Slow Mode  
DIN  
SCLK  
CS  
V
DD  
OUTB  
REF  
1
2
3
4
8
7
6
5
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
OUTA  
AGND  
description  
The TLV5638 is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows  
glueless interface to TMS320 and SPI, QSPI, and Microwireserial ports. It is programmed with a 16-bit  
serial string containing 4 control and 12 data bits.  
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class  
AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows  
the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage  
reference, the TLV5638 simplifies overall system design.  
Because of its ability to source up to 1 mA, the reference can also be used as a system reference. Implemented  
with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in  
an 8-pin SOIC package to reduce board space.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
−40°C to 125°C  
−55°C to 125°C  
SOIC − D  
SOIC − D  
Tape and reel  
Tape and reel  
TLV5638QDREP  
TLV5638MDREP  
5638QE  
5638ME  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
SPI and QSPI are trademarks of Motorola, Inc.  
Microwire is a trademark of National Semiconductor Corporation.  
ꢀꢧ  
Copyright 2002 − 2003, Texas Instruments Incorporated  
ꢣ ꢧ ꢤ ꢣꢜ ꢝꢰ ꢟꢞ ꢢ ꢪꢪ ꢨꢢ ꢠ ꢢ ꢡ ꢧ ꢣ ꢧ ꢠ ꢤ ꢋ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

TLV5638QDREP 替代型号

型号 品牌 替代类型 描述 数据表
TLV5638QD TI

完全替代

2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTER WITH INTERNAL REFERENCE A
TLV5638MDREP TI

类似代替

Controlled Baseline One Assembly/Test Site, One Fabrication Site
TLV5638IDR TI

类似代替

2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTER WITH INTERNAL REFERENCE A

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