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SGLS130B − JULY 2002 − REVISED DECEMBER 2003
D
Compatible With TMS320 and SPI Serial
features
Ports
D
Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
D
Differential Nonlinearity <0.5 LSB Typ
Monotonic Over Temperature
D
D
D
Extended Temperature Performance up to
−55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
applications
D
D
D
D
D
Digital Servo Control Loops
Digital Offset and Gain Adjustment
Industrial Process Control
D
D
D
D
D
Enhanced Product Change Notification
†
Qualification Pedigree
Machine and Motion Control Devices
Mass Storage Devices
Dual 12-Bit Voltage Output DAC
Programmable Internal Reference
D PACKAGE
(TOP VIEW)
Programmable Settling Time:
1 µs in Fast Mode,
3.5 µs in Slow Mode
DIN
SCLK
CS
V
DD
OUTB
REF
1
2
3
4
8
7
6
5
†
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
OUTA
AGND
description
The TLV5638 is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface allows
glueless interface to TMS320 and SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit
serial string containing 4 control and 12 data bits.
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class
AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC allows
the designer to optimize speed vs power dissipation. With its on-chip programmable precision voltage
reference, the TLV5638 simplifies overall system design.
Because of its ability to source up to 1 mA, the reference can also be used as a system reference. Implemented
with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It is available in
an 8-pin SOIC package to reduce board space.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
−40°C to 125°C
−55°C to 125°C
SOIC − D
SOIC − D
Tape and reel
Tape and reel
TLV5638QDREP
TLV5638MDREP
5638QE
5638ME
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI and QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corporation.
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Copyright 2002 − 2003, Texas Instruments Incorporated
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1
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