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TLV5618A_06 PDF预览

TLV5618A_06

更新时间: 2024-02-27 11:05:57
品牌 Logo 应用领域
德州仪器 - TI 转换器
页数 文件大小 规格书
24页 446K
描述
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN

TLV5618A_06 数据手册

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TLV5618A  
2.7-V TO 5.5-V LOW-POWER DUAL 12-BIT  
DIGITAL-TO-ANALOG CONVERTER WITH POWER DOWN  
SLAS230H – JULY 1999 – REVISED JULY 2002  
features  
applications  
D
D
Dual 12-Bit Voltage Output DAC  
D
D
D
D
D
Digital Servo Control Loops  
Digital Offset and Gain Adjustment  
Industrial Process Control  
Programmable Settling Time  
– 3 µs in Fast Mode  
– 10 µs in Slow Mode  
Machine and Motion Control Devices  
Mass Storage Devices  
D
D
D
D
Compatible With TMS320 and SPI Serial  
Ports  
P, D OR JG PACKAGE  
(TOP VIEW)  
Differential Nonlinearity <0.5 LSB Typ  
Monotonic Over Temperature  
DIN  
SCLK  
CS  
V
DD  
OUTB  
REF  
1
2
3
4
8
7
6
5
Direct Replacement for TLC5618A (C and I  
Suffixes)  
D
Available in Q-Temp Automotive  
HighRel Automotive Applications  
Configuration Control/Print Support  
Qualification to Automotive Standards  
OUTA  
AGND  
FK PACKAGE  
(TOP VIEW)  
description  
3
4
2
1
20 19  
TheTLV5618Aisadual12-bitvoltageoutputDAC  
with a flexible 3-wire serial interface. The serial  
interface is compatible with TMS320, SPI ,  
NC  
SCLK  
NC  
NC  
18  
17  
16  
15  
14  
OUTB  
NC  
5
6
7
QSPI , and Microwire  
serial ports. It is  
programmed with a 16-bit serial string containing  
4 control and 12 data bits.  
CS  
REF  
NC  
NC  
8
9
The resistor string output voltage is buffered by an  
x2 gain rail-to-rail output buffer. The buffer  
features a Class-AB output stage to improve  
stability and reduce settling time. The program-  
mablesettlingtimeoftheDACallowsthedesigner  
to optimize speed versus power dissipation.  
10 11 12 13  
Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It  
is available in an 8-pin SOIC package in standard commercial and industrial temperature ranges.  
The TLV5618AC is characterized for operation from 0°C to 70°C. The TLV5618AI is characterized for operation  
from 40°C to 85°C. The TLV5618AQ is characterized for operation from 40°C to 125°C. The TLV5618AM  
is characterized for operation from 55°C to 125°C.  
AVAILABLE OPTIONS  
PACKAGE  
T
A
PLASTIC DIP  
(P)  
SOIC  
(D)  
CERAMIC DIP  
(JG)  
20 PAD LCCC  
(FK)  
0°C to 70°C  
TLV5618ACP  
TLV5618AIP  
TLV5618ACD  
TLV5618AID  
40°C to 85°C  
TLV5618AQD  
TLV5618AQDR  
40°C to 125°C  
55°C to 125°C  
TLV5618AMJG  
TLV5618AMFK  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
SPI and QSPI are trademarks of Motorola, Inc.  
Microwire is a trademark of National Semiconductor Corporation.  
Copyright 2002, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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