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ꢋ ꢌꢍ ꢈꢂ ꢀ ꢎ ꢃ ꢌꢃ ꢈꢂ ꢁ ꢎꢏꢈꢊꢎ ꢏ ꢉꢐ ꢑꢒꢇ ꢁ ꢅꢋ ꢈꢓ ꢔ ꢀ
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SGLS214 − OCTOBER 2003
D
D
D
D
Compatible With TMS320 and SPI Serial
Ports
features
D
Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
Differential Nonlinearity <0.5 LSB Typ
Monotonic Over Temperature
D
D
Extended Temperature Performance of
−55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Direct Replacement for TLC5618A
applications
D
D
D
D
D
Digital Servo Control Loops
D
D
D
D
Enhanced Product-Change Notification
Digital Offset and Gain Adjustment
Industrial Process Control
†
Qualification Pedigree
Dual 12-Bit Voltage Output DAC
Machine and Motion Control Devices
Mass Storage Devices
Programmable Settling Time
− 3 µs in Fast Mode
− 10 µs in Slow Mode
D PACKAGE
(TOP VIEW)
†
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
DIN
SCLK
CS
V
DD
OUTB
REF
1
2
3
4
8
7
6
5
OUTA
AGND
description
The TLV5618A is a dual 12-bit voltage output DAC with a flexible 3-wire serial interface. The serial interface is
compatible with TMS320, SPI, QSPI, and Microwire serial ports. It is programmed with a 16-bit serial string
containing 4 control and 12 data bits.
The resistor string output voltage is buffered by an x2 gain rail-to-rail output buffer. The buffer features a
Class-AB output stage to improve stability and reduce settling time. The programmable settling time of the DAC
allows the designer to optimize speed versus power dissipation.
Implemented with a CMOS process, the device is designed for single supply operation from 2.7 V to 5.5 V. It
is available in an 8-pin SOIC package.
The TLV5618AM is characterized for operation from −55°C to 125°C.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
T
A
PACKAGE
−55°C to 125°C
SOIC (D)
Tape and reel
TLV5618AMDREP
5618ME
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI and QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor Corporation.
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Copyright 2003 Texas Instruments Incorporated
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1
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