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SGLS124A − JULY 2002 − REVISED DECEMBER 2003
D
Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
applications
D
D
D
Battery Powered Test Instruments
Digital Offset and Gain Adjustment
D
D
D
D
D
D
Extended Temperature Performance of
−40°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
Battery Operated/Remote Industrial
Controls
D
D
D
D
D
Machine and Motion Control Devices
Cordless and Wireless Telephones
Speech Synthesis
Enhanced Product Change Notification
†
Qualification Pedigree
Communication Modulators
Arbitrary Waveform Generation
Single Supply 2.7-V to 5.5-V Operation
0.4 LSB Differential Nonlinearity (DNL),
1.5 LSB Integral Nonlinearity (INL)
D
D
D
D
D
12-Bit Parallel Interface
Compatible With TMS320 DSP
Internal Power On Reset
Settling Time 1 µs Typ
Low Power Consumption:
− 8 mW for 5-V Supply
− 4.3 mW for 3-V Supply
DW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
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11
D2
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D6
D7
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D10
D11
D1
D0
CS
WE
LDAC
PD
GND
OUT
REFIN
D
D
D
D
Reference Input Buffers
Voltage Output
Monotonic Over Temperature
Asynchronous Update
V
DD
†
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
description
The TLV5619 is a 12-bit voltage output DAC with a microprocessor and TMS320 compatible parallel interface.
The 12 data bits are double buffered so that the output can be updated asynchronously using the LDAC pin.
During normal operation, the device dissipates 8 mW at a 5-V supply and 4.3 mW at a 3-V supply. The power
consumption can be lowered to 50 nW by setting the DAC to power-down mode.
The output voltage is buffered by a ×2 gain rail-to-rail amplifier, which features a Class A output stage to improve
stability and reduce settling time.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
T
A
PACKAGE
−40°C to 125°C
SOP − DW Tape and reel
TLV5619QDWREP
TLV5619QEP
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2002 − 2003, Texas Instruments Incorporated
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1
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