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TLP708(TP,F) PDF预览

TLP708(TP,F)

更新时间: 2024-11-25 13:01:03
品牌 Logo 应用领域
东芝 - TOSHIBA 光电输出元件
页数 文件大小 规格书
13页 389K
描述
Optocoupler - IC Output, 1 CHANNEL LINEAR OUTPUT OPTOCOUPLER, 15 Mbps, ROHS COMPLIANT, 11-5J1, SURFACE MOUNT, DIP-6

TLP708(TP,F) 技术参数

是否Rohs认证: 符合生命周期:End Of Life
包装说明:DIP-6Reach Compliance Code:unknown
HTS代码:8541.40.80.00风险等级:5.76
其他特性:OPEN COLLECTOR, UL RECOGNIZED配置:SINGLE
标称数据速率:15 MBps最大正向电流:0.025 A
最大绝缘电压:5000 V元件数量:1
最大通态电流:0.025 A最高工作温度:125 °C
最低工作温度:-40 °C光电设备类型:LINEAR IC OUTPUT OPTOCOUPLER
最小供电电压:4.5 VBase Number Matches:1

TLP708(TP,F) 数据手册

 浏览型号TLP708(TP,F)的Datasheet PDF文件第2页浏览型号TLP708(TP,F)的Datasheet PDF文件第3页浏览型号TLP708(TP,F)的Datasheet PDF文件第4页浏览型号TLP708(TP,F)的Datasheet PDF文件第5页浏览型号TLP708(TP,F)的Datasheet PDF文件第6页浏览型号TLP708(TP,F)的Datasheet PDF文件第7页 
TLP708  
TOSHIBA PHOTOCOUPLER GaAAs LED & PHOTO-IC  
TLP708,TLP708F  
Factory Automation (FA)  
TLP708  
Unit: mm  
Home Electrical Appliances  
4.58±0.25  
6 5 4  
Operates at high ambient temperatures up to 125°C  
The Toshiba TLP708 consists of a GaAAs light emitting diode and an integrated  
high-gain, high-speed photodetector. The TLP708 is housed in the SDIP6 package.  
Compared to the standard DIP8 package, TLP708 is smaller in size, yet comes with  
international safety standards under a reinforced isolation category. As such, it is  
possible to reduce the mounting footprint for applications that require certifications for  
safety standards.  
1
2 3  
7.62±0.25  
The photodetector has an open-collector output stage, and an internal Faraday shield  
that provides a guaranteed common-mode transient immunity of ±15 kV/μs. As  
TLP708 is also able to operate up to 125, it is suitable for use in applications like  
industrial equipments where it is necessary to operate under high ambient  
temperatures.  
1.27±0.2  
0.4±0.1  
1.25±0.25  
9.7±0.3  
TLP708F is of a long creepage distance and clearance distance type.  
11-5J1  
z Input threshold current :  
z Switching time (t /t  
I
5mA (Max)  
=
FHL  
TOSHIBA  
11-5J1  
):  
75ns (Max)  
pHL pLH  
z Data transfer rate:  
15 MBd (Typ.)  
-40 to 125℃  
4.5 to 5.5V  
Weight: 0.26 g (typ.)  
z Guaranteed Performance over temperature:  
z Power supply voltage:  
TLP708F  
Unit: mm  
4.58±0.25  
z Common mode transient immunity:  
z Isolation voltage:  
±15 kV /μs (Min)  
6
5 4  
5000V  
(Min)  
rms  
z Construction mechanical rating  
7.62 mm Pitch  
TLP708 Type  
10.16 mm Pitch  
TLP708F Type  
Creepage distance  
Clearance distance  
Insulation thickness  
7.0 mm (min)  
7.0 mm (min)  
0.4 mm (min)  
8.0 mm (min)  
8.0 mm (min)  
0.4 mm (min)  
1
2 3  
7.62±0.25  
z UL recognized:  
z cUL recognized:  
UL1577, File No. E67349  
CSA Component Acceptance Service No.5A,  
File No. E67349  
z VDE-approved: Option (D4) EN60747-5-2 (Note)  
Note: When an EN60747-5-2 approved type is needed,  
please designate the Option (D4).Option (D4) Type  
1.27±0.2  
0.4±0.1  
0.75±0.25  
11.7±0.3  
11-5J101  
TOSHIBA  
11-5J101  
Pin Configuration (Top View)  
Weight: 0.26 g (typ.)  
1:ANODE  
1
6
5
4
V
CC  
2:N.C.  
3:CATHODE  
4:GND  
2
3
5:V (Output)  
O
6:V  
CC  
GND  
SHIELD  
1
2012-07-27  

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