Datasheet > TLP3119(V4)

TLP3119(V4)

更新时间： 2024-11-08 21:20:47

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
6页	345K
描述
Solid State Relay

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中文翻译

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技术参数
数据手册

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TLP3119(V4) 技术参数

生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.75	Base Number Matches：	1

TLP3119(V4) 数据手册

TLP3119

TOSHIBA PHOTOCOUPLER PHOTO RELAY

TLP3119

Measurement Instruments

Unit: mm

The TOSHIBA TLP3119 mini-flat photorelay is a small-outline photorelay,

suitable for surface-mount assembly. The TLP3119 consists of an infrared-

emitting diode optically coupled to a photo-MOSFET and is housed in a 4-

pin package.

Features

•

4-pin SOP (2.54SOP4): 2.1 mm high, 2.54 mm pitch

1-Form-A

Peak Off-State Voltage: 80 V (min)

Trigger LED Current: 3 mA (max)

On-State Current: 200 mA (max)

On-State Resistance: 8 Ω (max)

Output Capacitance: 11 pF (max)

Isolation Voltage: 1500 Vrms (min)

UL-recognized: UL 1577, File No.E67349

cUL-recognized: CSA Component Acceptance Service No.5A

File No.E67349

JEDEC

―

JEITA

TOSHIBA

Weight: 0.1 g (typ.)

11−5H1

•

VDE-approved: EN 60747-5-5 (Note 1)

Note 1: When a VDE approved type is needed,

please designate the Option(V4).

Pin Configuration (Top View)

Schematic

1 : ANODE

2 : CATHODE

3 : DRAIN

4 : DRAIN

Start of commercial production

2004-10

2019-06-17

Toshiba Electronic Devices & Storage Corporation

12 3 4 5 6

中文翻译

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