Datasheet > TJC2010

TJC2010

更新时间： 2024-11-26 14:52:27

品牌	Logo	应用领域
TTELEC		/
页数	文件大小	规格书
2页	433K
描述
Thermal jumper chip, open circuit heat spreader

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TJC2010 数据手册

Thermal Jumper Chip

TJC Series

Features:

•

High thermal conducꢀvity

Electrically isolated

Aluminium nitride ceramic chips

Compact thermal management

Low capacitance

Pb-free or SnPb ﬁnish

All Pb-free parts comply with EU Direcꢀve 2011/65/EU amended by (EU) 2015/863 (RoHS3)

Functional Data

0603

°C/W 13.8

mW/°C 72.5

pF 0.16

0505

7.4

0805

11.8

84.7

0.16

0508

4.6

1206

14.7

0612

3.7

2010

1020

3.6

2512

14.9

67.1

0.05

1225

3.6

Thermal resistance

Thermal conductance

Capacitance typ. @1kHz

Ambient temperature range

135

0.27

217

0.4

270

0.43

66.7

0.07

278

0.31

278

0.46

0.11

°C

-55 to +155

Physical Data

Dimensions in mm and weight in mg

T max.

A nom.

0.59

0.54

0.69

0.55

0.71

0.63

0.78

0.74

0.89

0.9

B min.

C nom.

0.59

0.54

0.69

0.55

0.71

0.63

0.78

0.74

0.89

0.9

Wt. nom.

0603

1.5 ±0.1

0.8 ± 0.1

0.3

0.1

0.5

0.12

1.55

0.15

3.4

4.2

0505 1.21 ±0.1 1.21 ±0.1

0805

2 ±0.15

1.25 ±0.15

2 ±0.15

5.9

0508 1.25 ±0.15

5.9

1206

0612

2010

1020

2512

1225

3.2 ±0.2

1.6 ±0.2

5.1 ±0.3

2.5 ±0.2

6.5 ±0.3

3.2 ±0.2

1.6 ±0.2

3.2 ±0.2

2.5 ±0.2

5.1 ±0.3

3.2 ±0.2

6.5 ±0.3

11.3

12.1

29.2

31.9

43.9

49.7

0.8

4.3

1.1

Construcꢀon

Ag terminaꢀons are screen printed onto an aluminium nitride (AlN) substrate. Parts are wrap-around terminated and plated with nickel

then either 100% maꢁ Sn or 60/40 SnPb.

Marking

Components are not marked. Reels are marked with type, date code and quanꢀty.

Packing

2010, 1020, 2512 & 1225 sizes are supplied on 12mm plasꢀc carrier tape. All smaller sizes are supplied on 8mm plasꢀc carrier tape. All

sizes are on 178mm (7 inch) reels as per IEC286-3. For packaging dimensions of sizes 0805 and larger in convenꢀonal and inverse formats

see hꢁps://www.ꢁelectronics.com/TTElectronics/media/ProductFiles/Applicaꢀon-Note/PS003-Packing-of-Specialist-Chip-Resistors.pdf.

Performance Data

Test

Temperature cycling

Shear strength

Solderability

Method

Result

1000 cycles, -55/125°C, 60 seconds transition, 30 minutes dwell

18N shear force, performed before and after temperature cycling

245 ± 5°C for 2 ±0.5s

No visual damage

≥95% coverage

General Note

BI Technologies IRC Welwyn

TT Electronics reserves the right to make changes in product speciﬁcaꢀon without noꢀce or liability.

All informaꢀon is subject to TT Electronics’ own data and is considered accurate at ꢀme of going to print.

www.ꢁelectronics.com/resistors

06.23

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与TJC2010相关器件

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TJC2512	TTELEC	获取价格	Thermal jumper chip, open circuit heat spreader
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TJF1051T/1J	NXP	获取价格	TJF1051 - High-speed CAN transceiver SOIC 8-Pin
TJF1051T/3	NXP	获取价格	DATACOM, ETHERNET TRANSCEIVER, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8
TJF1051T/3,112	NXP	获取价格	TJF1051 - High-speed CAN transceiver SOIC 8-Pin

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