是否无铅: | 不含铅 | 生命周期: | Active |
零件包装代码: | MODULE | 包装说明: | , |
针数: | 6 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 0.61 |
接口集成电路类型: | INTERFACE CIRCUIT | JESD-30 代码: | R-XSMA-X6 |
JESD-609代码: | e4 | 长度: | 6 mm |
湿度敏感等级: | 4 | 功能数量: | 1 |
端子数量: | 6 | 最高工作温度: | 85 °C |
最低工作温度: | -25 °C | 封装主体材料: | UNSPECIFIED |
封装形状: | RECTANGULAR | 封装形式: | MICROELECTRONIC ASSEMBLY |
峰值回流温度(摄氏度): | 255 | 认证状态: | Not Qualified |
座面最大高度: | 2 mm | 最大供电电压: | 5.5 V |
最小供电电压: | 2.4 V | 标称供电电压: | 5 V |
电源电压1-最大: | 5.5 V | 电源电压1-分钟: | 2.4 V |
电源电压1-Nom: | 5 V | 表面贴装: | NO |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | Gold (Au) - with Nickel (Ni) barrier | 端子形式: | UNSPECIFIED |
端子节距: | 0.95 mm | 端子位置: | SINGLE |
处于峰值回流温度下的最长时间: | 10 | 宽度: | 3 mm |
Base Number Matches: | 1 |
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