品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | / | |
页数 | 文件大小 | 规格书 |
5页 | 80K | |
描述 | ||
VERTICAL DEFLECTION BOOSTER |
是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | ZFM | 包装说明: | PLASTIC, HEPTAWATT-7 |
针数: | 7 | Reach Compliance Code: | not_compliant |
风险等级: | 5.26 | 商用集成电路类型: | VERTICAL DEFLECTION IC |
JESD-30 代码: | R-PZFM-T7 | JESD-609代码: | e0 |
功能数量: | 1 | 端子数量: | 7 |
最高工作温度: | 75 °C | 最低工作温度: | -20 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | ZIP |
封装等效代码: | ZIP7,.2,.1TB | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 电源: | 10/35 V |
认证状态: | Not Qualified | 子类别: | Deflection ICs |
最大供电电压 (Vsup): | 35 V | 最小供电电压 (Vsup): | 10 V |
表面贴装: | NO | 温度等级: | COMMERCIAL EXTENDED |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | THROUGH-HOLE |
端子节距: | 1.27 mm | 端子位置: | ZIG-ZAG |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TDA8172 | STMICROELECTRONICS |
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