生命周期: | Active | 包装说明: | HVQFN-32 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.55 | 其他特性: | IT ALSO OPERATES AT 3, 5 V |
模拟集成电路 - 其他类型: | ANALOG CIRCUIT | JESD-30 代码: | S-PQCC-N32 |
长度: | 5 mm | 功能数量: | 1 |
端子数量: | 32 | 最高工作温度: | 85 °C |
最低工作温度: | -25 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 座面最大高度: | 1 mm |
最大供电电压 (Vsup): | 1.94 V | 最小供电电压 (Vsup): | 1.66 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
温度等级: | OTHER | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
宽度: | 5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TDA8035HN/C2/S1 | NXP |
获取价格 |
SPECIALTY ANALOG CIRCUIT | |
TDA8035HN/C2/S1J | NXP |
获取价格 |
TDA8035HN - High integrated and low power smart card interface QFN 32-Pin | |
TDA8035HN/C2/S1QL | NXP |
获取价格 |
TDA8035HN - High integrated and low power smart card interface QFN 32-Pin | |
TDA8037T | NXP |
获取价格 |
Low power 3V smart card interface | |
TDA8037T/C1Y | NXP |
获取价格 |
TDA8037 - Low power 3V smart card interface SOP 28-Pin | |
TDA8037TT | NXP |
获取价格 |
Low power 3V smart card interface | |
TDA8040T | NXP |
获取价格 |
Quadrature demodulator | |
TDA8040TD | NXP |
获取价格 |
IC SPECIALTY TELECOM CIRCUIT, PDSO16, Telecom IC:Other | |
TDA8040TD-T | NXP |
获取价格 |
IC SPECIALTY TELECOM CIRCUIT, PDSO16, Telecom IC:Other | |
TDA8040T-T | NXP |
获取价格 |
RF/Microwave Modulator/Demodulator, 21.4 MHz - 300 MHz RF/MICROWAVE I/Q DEMODULATOR |