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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| TDA1062S | ETC |
获取价格 |
MONOLITHIC INTEGRATED CIRCUIT |
|
| TDA1072A | TEMIC |
获取价格 |
AM Receiver Circuit |
|
| TDA1072A | NXP |
获取价格 |
AM receiver circuit |
|
| TDA1072AN | NXP |
获取价格 |
IC AM, AUDIO SINGLE CHIP RECEIVER, PDIP16, Receiver IC |
|
| TDA1072AT | NXP |
获取价格 |
AM receiver circuit |
|
| TDA1072AT/V4,112 | NXP |
获取价格 |
IC AM, AUDIO SINGLE CHIP RECEIVER, PDSO16, PLASTIC, SOT-109A, SO-16, Receiver IC |
|
| TDA1072ATD | NXP |
获取价格 |
IC AM, AUDIO SINGLE CHIP RECEIVER, PDSO16, PLASTIC, SOT-109A, SO-16, Receiver IC |
|
| TDA1072ATD-T | NXP |
获取价格 |
IC AM, AUDIO SINGLE CHIP RECEIVER, PDSO16, PLASTIC, SOT-109A, SO-16, Receiver IC |
|
| TDA1074 | NXP |
获取价格 |
Dual tandem electronic potentiometer circuit |
|
| TDA1074A | NXP |
获取价格 |
Dual tandem electronic potentiometer circuit |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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