是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOT-23 |
包装说明: | PLASTIC, TO-236, SOT-23B, 3 PIN | 针数: | 3 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 5 weeks 2 days |
风险等级: | 0.72 | Samacsys Confidence: | 3 |
Samacsys Status: | Released | Samacsys PartID: | 160714 |
Samacsys Pin Count: | 3 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | SOT23 (3-Pin) | Samacsys Footprint Name: | TCM809SENB713-1 |
Samacsys Released Date: | 2015-05-24 21:47:42 | Is Samacsys: | N |
可调阈值: | NO | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PDSO-G3 | JESD-609代码: | e3 |
长度: | 2.92 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 3 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | TSSOP | 封装等效代码: | TO-236 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.2/5.5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.12 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.025 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
温度等级: | INDUSTRIAL | 端子面层: | Matte Tin (Sn) - annealed |
端子形式: | GULL WING | 端子节距: | 0.96 mm |
端子位置: | DUAL | 阈值电压标称: | +2.93V |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 1.3 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
TCM809SVNB713 | MICROCHIP |
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