生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | LSSOP, SSOP16,.25 | 针数: | 16 |
Reach Compliance Code: | unknown | HTS代码: | 8542.31.00.01 |
风险等级: | 5.64 | Is Samacsys: | N |
JESD-30 代码: | R-PDSO-G16 | JESD-609代码: | e0 |
长度: | 5 mm | 端子数量: | 16 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LSSOP |
封装等效代码: | SSOP16,.25 | 封装形状: | RECTANGULAR |
封装形式: | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | 电源: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.6 mm |
子类别: | Other Microprocessor ICs | 最大压摆率: | 5 mA |
最大供电电压: | 5.25 V | 最小供电电压: | 4.35 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN LEAD | 端子形式: | GULL WING |
端子节距: | 0.65 mm | 端子位置: | DUAL |
宽度: | 4.4 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT |
Base Number Matches: | 1 |
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