生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | LSSOP, SSOP16,.25 | 针数: | 16 |
Reach Compliance Code: | unknown | HTS代码: | 8542.31.00.01 |
风险等级: | 5.64 | JESD-30 代码: | R-PDSO-G16 |
JESD-609代码: | e0 | 长度: | 5 mm |
端子数量: | 16 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | LSSOP | 封装等效代码: | SSOP16,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.6 mm | 子类别: | Other Microprocessor ICs |
最大压摆率: | 5 mA | 最大供电电压: | 5.25 V |
最小供电电压: | 4.35 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL | 端子面层: | TIN LEAD |
端子形式: | GULL WING | 端子节距: | 0.65 mm |
端子位置: | DUAL | 宽度: | 4.4 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR CIRCUIT | Base Number Matches: | 1 |
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