Datasheet > TC2H206J035LBSZ9823

TC2H206J035LBSZ9823

更新时间： 2024-11-07 11:17:19

品牌	Logo	应用领域
京瓷/艾维克斯 - KYOCERA AVX		/
页数	文件大小	规格书
3页	242K
描述
DLA Low ESR Tantalum Stacked Chip

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TCP Series - DSCC 09009

TCP Series Low ESR Tantalum Modules

TCP Series tantalum modules

a wide range of SMT board assembly

processes including reflow solder or

conductive epoxy.

represent high packing density for

applications utilizing multiple com-

ponents in a parallel configuration,

and are available with testing to

DSCC 09009.

There are two termination finishes

available: hot solder dipped (“C”) and

gold plated (“B”).

These modules feature stacked

assemblies of CWR29 capacitors

which provide ultra low ESR and uti-

lize established reliability capacitors

(Weibull Grade voltage conditioning)

in accordance with MIL-PRF-55365.

They can also be supplied with

SRC9000 Space Level components.

The molding compound has been

selected to meet the requirements of

UL94V-0 and outgassing require-

ments of ASTM E-595.

For moisture sensitivity levels please

refer to the High Reliability Tantalum

MSL section located in the back of

the High Reliability Tantalum Catalog.

The stacked construction of fully

molded capacitors is compatible with

Note: Additional form factors and ratings are available.

Contact plant for details.

CAPACITANCE AND RATED VOLTAGE

CASE SIZE (ESR IN m⍀)

Capacitance

Rated voltage DC (V_R) to 85ºC

μF

9.4

18.8

28.2

Code

945

196

206

286

406

606

666

946

137

197

207

287

407

447

607

667

887

138

208

10V

15V

20V

25V

35V

50V

2H (200)

4H (100)

2H (200)

6H (67)

4H (100)

6H (67)

2H (85)

4H (43)

6H (28)

2H (75)

4H (38)

132

188

198

200

282

400

440

600

660

880

1,320

1,980

2H (63)

4H (31)

6H (21)

6H (25)

2H (50)

4H (25)

6H (17)

4H (25)

6H (17)

FEBRUARY 2015 ■ 27

12 3

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