®
TB1S – TB10S
1.0A SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
WON-TOP ELECTRONICS
Pb
Features
G
D
Ultra-Slim 1.5mm Max. Case Height
Glass Passivated Die Construction
High Reliability
Low Forward Voltage Drop
High Surge Current Capability
Designed for Surface Mount Application
Plastic Material – UL Flammability 94V-0
L
-
+
~
B
E
~
C
A
K
TB-S
Dim
A
Min
4.80
4.20
0.10
0.05
6.00
0.30
1.30
3.80
0.60
Max
5.20
4.60
0.30
0.15
6.40
0.80
1.50
4.20
0.70
Mechanical Data
J
B
Case: TB-S, Molded Plastic
Terminals: Plated Leads Solderable per
MIL-STD-202, Method 208
C
D
E
Polarity: As Marked on Case
Weight: 0.10 grams (approx.)
Mounting Position: Any
Marking: Type Number
Lead Free: For RoHS / Lead Free Version,
Add “-LF” Suffix to Part Number, See Page 4
G
J
K
L
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @TA=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
TB1S
TB2S
TB4S
TB6S
TB8S TB10S Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
100
70
200
140
400
280
600
420
800
560
1000
700
V
RMS Reverse Voltage
VR(RMS)
IO
V
A
Average Rectified Output Current (Note 1) @TA = 25°C
1.0
30
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
(JEDEC Method)
IFSM
VFM
A
V
Forward Voltage per diode
@IF = 0.4A
@IF = 1.0A
0.95
1.1
Peak Reverse Current
At Rated DC Blocking Voltage
@TA = 25°C
@TA = 125°C
5.0
500
IRM
CJ
µA
pF
Typical Junction Capacitance per leg (Note 2)
10
Thermal Resistance Junction to Ambient (Note 1)
Thermal Resistance Junction to Lead (Note 3)
RθJA
RθJL
62.5
25
°C/W
°C
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
Note: 1. Mounted on aluminum substrate PCB with 1.3 x 1.3mm pad areas.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
3. Mounted on glass epoxy PCB with 1.3 x 1.3mm pad areas.
© Won-Top Electronics Co., Ltd.
Revision: December, 2013
www.wontop.com
1