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SX-PCEAC2-HMC

更新时间： 2024-11-19 02:52:23
品牌 Logo 应用领域
希来凯思 - SILEX 局域网WLAN无线局域网
页数 文件大小 规格书
1页 756K
描述
2x2 Dual Band 802.11ac WLAN Plus BT Combo Module

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中文翻译

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SX-PCEAC2-HMC 数据手册

  
SX-PCEAC2  
2x2 Dual Band 802.11ac WLAN Plus BT  
Combo Module  
Form Factors includes M.2 LGA, M.2 PCIe and Half Mini Card Options  
The SX-PCEAC2 is a dual-band 802.11 a/b/g/n/ac module with  
bluetooth support which is designed for devices that require wireless  
connectivity in a small form factor combined with high performance  
with throughouts reaching upto 867Mbps.  
/M2  
The SX-PCEAC2 is powered by Qualcomm Atheros radio chip, the  
QCA6174-5 which features 2x2 wave 2 MU-MIMO technology. There are  
a few form factors available . The surface mount option, the M.2 LGA  
type 1216, oꢀers the lowest footprint. Where as the M.2 card form factor  
is suitable who are looking to migrate from their legacy PCIe radios to  
an 802.11ac solution. The half mini card option also allows ꢁexibility to  
customers to evaluate the radio using any platform that has a full PCIe  
slot.  
Speciꢂcations:  
Key Features:  
Product Name  
Chipset  
SX-PCEAC2-SMT / SX-PCEAC2-HMC / SX-PCEAC2-M2  
QCA6174-5  
Dual-Band 802.11ac Wave2 with MU-MIMO  
•
SX-PCEAC2 is a 802.11ac WLAN plus Bluetooth combo solution that  
supports 2x2 MU-MIMO with two spatial streams for designed to  
deliver superior WLAN and BT performance.  
Host Interface  
WLAN: PCIe BT: USB  
Radio Speciꢂcations  
Bluetooth Speciꢂcations  
Security  
802.11a/b/g/n/ac (2x2)  
Multiple Form Factors for Diverse Needs  
SX-PCEAC2 s available in surface mount (M.2 LGA Type), M.2 1630 PCI  
Express Card and half mini PCIe form factors.  
•
•
Bluetooth v5.0 (BR/EDR/LE）  
WPA/WPA2  
802.11x (LEAP, PEAP, TLS, TTLS, FAST)  
Enterprise Security Support  
Operating Voltage  
3.3V +/-5%  
The SX-PCEAC2 supports WPA and WPA2 including 802.1x Extensible  
Authentication Protocol (EAP) types. It provides robust security for  
enterprise demands.  
[2.4GHz] Tx: 970mA ; Rx: 150mA  
[5GHz] Tx: 940mA; Rx 210mA  
Idle: 10mA ; Radio Oꢀ: 3mA  
Current Consumption  
(Peak Value)  
Support from Design to Manufacture  
•
•
-20°C to +70 °C  
Operating Temperature  
Dimensions  
As Qualcomm’s Authorized Deisgn Center, we have direct access to  
their design information that enables us to provide premium  
hardware and software support from design through deployment.  
SX-PCEAC2-SMT: 12.0 x 16.0 x 1.5 (mm)  
SX-PCEAC2-HMC: 30.0 x 26.8 x 3.4 (mm)  
SX-PCEAC2-M2: 16.5x30.0x2.34 (mm)  
Modular Certiꢀcations  
Modular certiꢂcations and approvals available for FCC (USA), IC  
(Canada), ETSI (Europe), MIC (Japan).  
Linux, ath10k, Windows  
FCC / IC / CE / MIC  
Driver Options  
Modular Certiꢂcations  
silex technology is a registered trademark of silex technology, Inc. Other product or brand names may be registered trademarks or trademarks of their respective owners.  
Technical information and speciꢂcations are subject to change without notice. © 2020 silex technology, Inc. All rights reserved.  
silex global sales & support locations  
Corporate Headquarters  
silex technology, Inc.  
+81-774-98-3781  
www.silex.jp  
support@silex.jp  
US Oꢀce  
silex technology america, Inc.  
+1-657-218-5199  
Europe Oꢀce  
India Oꢀce  
silex technology europe, GmbH silex technology india, Pvt. Ltd.,.  
+49-2154-88967-0  
+91-44-43033234  
www.silex-india.com  
support@silex-india.com  
www.silextechnology.com  
sales@silexamerica.com  
Germany toll free 0800-7453938  
www.silextechnology.com  
sales@silexeurope.com  
PN: 141-xxxxx-xxx  
REV B. 20200120  
1

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