是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | PLASTIC, BGA-388 |
针数: | 388 | Reach Compliance Code: | not_compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.89 |
Is Samacsys: | N | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
总线兼容性: | PCI; ISA | 最大时钟频率: | 14.318 MHz |
外部数据总线宽度: | 32 | JESD-30 代码: | S-PBGA-B388 |
JESD-609代码: | e0 | 长度: | 35 mm |
I/O 线路数量: | 16 | 端子数量: | 388 |
最高工作温度: | 85 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA388,26X26,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 2.5,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.38 mm | 速度: | 100 MHz |
子类别: | Microprocessors | 最大供电电压: | 2.7 V |
最小供电电压: | 2.45 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | COMMERCIAL EXTENDED | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 35 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
STPCE1EEBI | STMICROELECTRONICS |
获取价格 |
X86 Core General Purpose PC Compatible System - on - Chip | |
STPCE1HDBC | STMICROELECTRONICS |
获取价格 |
X86 Core General Purpose PC Compatible System - on - Chip | |
STPCE1HDBI | STMICROELECTRONICS |
获取价格 |
X86 Core General Purpose PC Compatible System - on - Chip | |
STPCE1HDC | STMICROELECTRONICS |
获取价格 |
MULTIFUNCTION PERIPHERAL, PBGA388, PLASTIC, BGA-388 | |
STPCE1HEBC | STMICROELECTRONICS |
获取价格 |
X86 Core General Purpose PC Compatible System - on - Chip | |
STPCE1HEBI | STMICROELECTRONICS |
获取价格 |
X86 Core General Purpose PC Compatible System - on - Chip | |
STPCELITE | STMICROELECTRONICS |
获取价格 |
X86 Core General Purpose PC Compatible System - on - Chip | |
STPCI01 | ETC |
获取价格 |
STPC INDUSTRIAL / PC COMPATIBLE EMBEDED MICROPROCESSOR | |
STPCI0110BTC3 | STMICROELECTRONICS |
获取价格 |
STPCI0110BTC3, BGA-388 | |
STPCI0166BTC3 | STMICROELECTRONICS |
获取价格 |
PC Compatible Embedded Microprocessor |