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STCD2300F35F PDF预览

STCD2300F35F

更新时间: 2024-11-12 20:57:31
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 驱动逻辑集成电路
页数 文件大小 规格书
39页 1942K
描述
LOW SKEW CLOCK DRIVER

STCD2300F35F 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.77JESD-30 代码:R-PBGA-B12
逻辑集成电路类型:LOW SKEW CLOCK DRIVER端子数量:12
最高工作温度:85 °C最低工作温度:-20 °C
封装主体材料:PLASTIC/EPOXY封装代码:FBGA
封装等效代码:BGA12,3X4,16封装形状:RECTANGULAR
封装形式:GRID ARRAY, FINE PITCH电源:3/5 V
认证状态:Not Qualified子类别:Clock Drivers
表面贴装:YES温度等级:OTHER
端子形式:BALL端子节距:0.4 mm
端子位置:BOTTOMBase Number Matches:1

STCD2300F35F 数据手册

 浏览型号STCD2300F35F的Datasheet PDF文件第2页浏览型号STCD2300F35F的Datasheet PDF文件第3页浏览型号STCD2300F35F的Datasheet PDF文件第4页浏览型号STCD2300F35F的Datasheet PDF文件第5页浏览型号STCD2300F35F的Datasheet PDF文件第6页浏览型号STCD2300F35F的Datasheet PDF文件第7页 
STCD22x0, STCD23x0, STCD24x0  
Multichannel clock distribution circuit  
Features  
2, 3 or 4 output buffered clock distribution  
Single-ended square wave (or sine wave) clock  
input  
Rail-to-rail (0 V to VTCXO) square wave output  
Individual enable pin for each output  
1.8 V, high PSRR LDO for external clock  
source voltage supply (VTCXO)  
No AC coupling capacitor needed  
Ultra-low phase noise and standby current  
Flip Chip (12-bump, 16-bump)  
Common system clock request, open drain,  
active low  
Clock enable signal polarities factory  
programmable (STCD23x0)  
Option pins allow clock enable polarities to be  
Applications  
user configurable (STCD22x0 and STCD24x0)  
Multimode RF clock reference  
High isolation output-to-output & output-to-input  
2.5 V to 5.1 V battery supply voltage  
Baseband peripheral device clock reference  
Mobile Internet Devices (MIDs)  
40 pF max load driving capability per output  
Available in chip scale package (CSP)  
Operating temperature : –20 °C to 85 °C  
Table 1.  
Reference  
Device summary  
Part number  
Channels  
Enable polarity  
Package  
Flip Chip 12-bump  
(1.2 mm x 1.6 mm)  
STCD22x0  
STCD24x0  
STCD2200(1)  
2-channel  
User program  
STCD2400  
STCD2410(1)  
STCD2300(1)  
STCD2310(1)  
STCD2320(1)  
STCD2330(1)  
Flip Chip 16-bump  
(1.6 mm x 1.6 mm)  
4-channel  
3-channel  
Flip Chip 12-bump  
(1.2 mm x 1.6 mm)  
STCD23x0  
Factory program  
1. Contact local ST sales office for availability.  
January 2010  
Doc ID 15400 Rev 2  
1/39  
www.st.com  
1
 
 

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