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ST6G3244ME PDF预览

ST6G3244ME

更新时间: 2024-10-01 01:19:51
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
27页 662K
描述
Level translator for SD, SDIO, mini SD, and micro SD Cards with internal I/O supply and ±15 kV ESD protection

ST6G3244ME 数据手册

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ST6G3244ME  
Level translator for SD, SDIO, mini SD, and micro SD Cards  
with internal I/O supply and 15 kV ESD protection  
Features  
Supports 60 MHz clock rate  
Supports DDR mode for SD Card™  
Compliant with  
– SD Specification Part 1 Physical Layer  
Specification 3.00 (SDR12, SDR25,  
DDR50)  
– SD Specification Part 1 Physical Layer  
Specification 2.00  
Flip Chip 25  
Bi-directional with direction control pin  
Balanced propagation delays: t  
t  
PHL  
PLH  
LDO power-down support. When the LDO is  
powered down, V is pulled to GND via  
Operating temperature range –40 °C to +85 °C  
CCB  
the 130 Ω resistor. When V  
= 0 V, there is  
Space-saving Flip Chip 25 package  
CCB  
no additional leakage seen on V  
.
(2 x 2 x 0.605 mm, 0.4 mm bump pitch)  
CCA  
EMI filtering and signal conditioning  
RoHS compliant, lead-free soldering capable  
Supports both 1.8 V and 2.9 V data translation  
on card side  
Applications  
Integrated LDO to supply 1.8 V or 2.9 V power  
for B-side I/Os (pin-selectable); can be used  
also externally  
Mobile phones, smartphones  
PDAs  
Cameras  
Integrated pull-up and pull-down resistors on  
B-side  
SD Card readers  
Any device with SD memory card  
Operating voltage range  
– V  
– V  
= 1.62 V to 1.98 V  
= 3.0 V to 5.0 V  
CCA  
BAT  
Table 1.  
Device summary  
Package  
topmark  
Latch-up performance exceeds 100 mA  
Order code  
Package  
Packing  
(JEDEC Standard 78)  
ESD protection for card side (B-port, CD and  
Flip Chip 25  
2 x 2 x  
ST6G3244MEBJR 0.605 mm,  
0.4 mm  
Tape  
and reel  
(5000  
partsper  
reel)  
WP pins)  
VKH,  
VKV  
8 kV contact discharge (IEC61000-4-2)  
15 kV air-gap discharge (IEC61000-4-2)  
bump pitch  
ESD protection for host side (A-side)  
2 kV HBM (JEDEC 22-A114)  
200 V MM (JEDEC 22-A115)  
November 2011  
Doc ID 022157 Rev 2  
1/27  
www.st.com  
1
 
 
 
 

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