8 Mbit / 16 Mbit (x8) Multi-Purpose Flash
SST39LF080 / SST39LF016 / SST39VF080 / SST39VF016
SST39LF/VF080 / 0163.0 & 2.7V 8Mb / 16Mb (x8) MPF memories
Data Sheet
FEATURES:
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Organized as 1M x8 / 2M x8
Single Voltage Read and Write Operations
– 3.0-3.6V for SST39LF080/016
– 2.7-3.6V for SST39VF080/016
Superior Reliability
– Endurance: 100,000 Cycles (typical)
– Greater than 100 years Data Retention
Low Power Consumption:
– Active Current: 15 mA (typical)
– Standby Current: 4 µA (typical)
– Auto Low Power Mode: 4 µA (typical)
Sector-Erase Capability
– Uniform 4 KByte sectors
Block-Erase Capability
– Uniform 64 KByte blocks
Fast Read Access Time:
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Fast Erase and Byte-Program:
– Sector-Erase Time: 18 ms (typical)
– Block-Erase Time: 18 ms (typical)
– Chip-Erase Time: 70 ms (typical)
– Byte-Program Time: 14 µs (typical)
– Chip Rewrite Time:
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15 seconds (typical) for SST39LF/VF080
30 seconds (typical) for SST39LF/VF016
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Automatic Write Timing
– Internal VPP Generation
End-of-Write Detection
– Toggle Bit
– Data# Polling
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CMOS I/O Compatibility
JEDEC Standard
– Flash EEPROM Pinouts and command sets
Packages Available
– 40-lead TSOP (10mm x 20mm)
– 48-ball TFBGA (6mm x 8mm)
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– 55 ns for SST39LF080/016
– 70 and 90 ns for SST39VF080/016
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Latched Address and Data
PRODUCT DESCRIPTION
The SST39LF/VF080/016 devices are 1M x8 / 2M x8
CMOS Multi-Purpose Flash (MPF) manufactured with
SST’s proprietary, high performance CMOS SuperFlash
technology. The split-gate cell design and thick oxide tun-
neling injector attain better reliability and manufacturability
compared with alternate approaches. The SST39LF080/
016 write (Program or Erase) with a 3.0-3.6V power supply.
The SST39VF080/016 write (Program or Erase) with a 2.7-
3.6V power supply. They conform to JEDEC standard
pinouts for x8 memories.
native flash technologies. The total energy consumed is a
function of the applied voltage, current, and time of applica-
tion. Since for any given voltage range, the SuperFlash
technology uses less current to program and has a shorter
erase time, the total energy consumed during any Erase or
Program operation is less than alternative flash technolo-
gies. They also improve flexibility while lowering the cost for
program, data, and configuration storage applications.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose Erase
and Program times increase with accumulated Erase/Pro-
gram cycles.
Featuring high performance Byte-Program, the SST39LF/
VF080/016 devices provide a typical Byte-Program time of
14 µsec. The devices use Toggle Bit or Data# Polling to
indicate the completion of Program operation. To protect
against inadvertent write, they have on-chip hardware and
Software Data Protection schemes. Designed, manufac-
tured, and tested for a wide spectrum of applications, these
devices are offered with a guaranteed endurance of 10,000
cycles. Data retention is rated at greater than 100 years.
To meet high density, surface mount requirements, the
SST39LF/VF080/016 are offered in 40-lead TSOP and 48-
ball TFBGA packaging. See Figures 1 and 2 for pinouts.
The SST39LF/VF080/016 devices are suited for applica-
tions that require convenient and economical updating of
program, configuration, or data memory. For all system
applications, they significantly improve performance and
reliability, while lowering power consumption. They inher-
ently use less energy during Erase and Program than alter-
©2002 Silicon Storage Technology, Inc.
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
Multi-Purpose Flash and MPF are trademarks of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.
S71146-03-000 2/02
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