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SSI3N80A PDF预览

SSI3N80A

更新时间: 2024-11-20 23:34:23
品牌 Logo 应用领域
其他 - ETC 晶体晶体管
页数 文件大小 规格书
7页 376K
描述
TRANSISTOR | MOSFET | N-CHANNEL | 800V V(BR)DSS | 3A I(D) | TO-262AA

SSI3N80A 数据手册

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SSW/I3N80A  
Advanced Power MOSFET  
FEATURES  
BVDSS = 800 V  
RDS(on) = 4.8 W  
ID = 3 A  
Avalanche Rugged Technology  
Rugged Gate Oxide Technology  
Lower Input Capacitance  
Improved Gate Charge  
Extended Safe Operating Area  
Lower Leakage Current : 25 mA (Max.) @ VDS = 800V  
Low RDS(ON) : 3.800 W (Typ.)  
D2-PAK  
I2-PAK  
2
1
1
2
3
3
1. Gate 2. Drain 3. Source  
Absolute Maximum Ratings  
Symbol  
Characteristic  
Drain-to-Source Voltage  
Value  
800  
3
Units  
VDSS  
V
O
Continuous Drain Current (TC=25 C)  
ID  
A
O
Continuous Drain Current (TC=100 C)  
1.9  
12  
1
IDM  
VGS  
EAS  
IAR  
Drain Current-Pulsed  
A
V
O
+
_
Gate-to-Source Voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
30  
2
240  
3
mJ  
A
O
1
O
EAR  
dv/dt  
Repetitive Avalanche Energy  
10  
mJ  
V/ns  
W
1
O
Peak Diode Recovery dv/dt  
3
2.0  
3.1  
100  
0.8  
O
O
*
Total Power Dissipation (TA=25 C)  
O
PD  
Total Power Dissipation (TC=25 C)  
W
Linear Derating Factor  
O
W/ C  
Operating Junction and  
Storage Temperature Range  
TJ , TSTG  
- 55 to +150  
300  
O
C
Maximum Lead Temp. for Soldering  
Purposes, 1/8“ from case for 5-seconds  
TL  
Thermal Resistance  
Symbol  
Characteristic  
Junction-to-Case  
Case-to-Sink  
Typ.  
Max.  
1.25  
40  
Units  
R q  
--  
--  
--  
JC  
O
R q  
C/W  
CS  
R q  
62.5  
Junction-to-Ambient  
JA  
*
When mounted on the minimum pad size recommended (PCB Mount).  
Rev. B  
©1999 Fairchild Semiconductor Corporation  

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