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SRR0604-2R2ML PDF预览

SRR0604-2R2ML

更新时间: 2024-11-07 01:18:11
品牌 Logo 应用领域
伯恩斯 - BOURNS 测试功率感应器电感器
页数 文件大小 规格书
2页 255K
描述
Shielded Power Inductors

SRR0604-2R2ML 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:2626
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8504.50.80.00Factory Lead Time:20 weeks
风险等级:1.45Samacsys Description:Fixed Inductors 2.2uH 20% SMD 0604
大小写代码:2626构造:Rectangular
型芯材料:Ferrite直流电阻:0.032 Ω
标称电感 (L):2.2 µH电感器应用:POWER INDUCTOR
电感器类型:GENERAL PURPOSE INDUCTORJESD-609代码:e3
功能数量:1端子数量:2
最高工作温度:125 °C最低工作温度:-40 °C
封装高度:4.6 mm封装长度:6.5 mm
封装形式:SMT封装宽度:6.5 mm
包装方法:TR, Embossed , 13 Inch最大额定电流:2.5 A
自谐振频率:100 MHz形状/尺寸说明:RECTANGULAR PACKAGE
屏蔽:YES表面贴装:YES
端子面层:Matte Tin (Sn) - with Nickel (Ni) barrier端子位置:DUAL ENDED
端子形状:WRAPAROUND测试频率:0.001 MHz
容差:20%

SRR0604-2R2ML 数据手册

 浏览型号SRR0604-2R2ML的Datasheet PDF文件第2页 
Features  
Applications  
Available in E6 series  
Low unit height of 4.8 mm  
High current  
Input/output of DC/DC converters  
Power supplies for:  
• Portable communication equipment  
• Camcorders  
RoHS compliant*  
• LCD TVs  
• Car radios  
SRR0604 Series - Shielded Power Inductors  
Electrical Specifications  
General Specifications  
Test Voltage...................................1 Volt  
Reflow Soldering .. 230 °C, 50 sec. max.  
Operating Temperature  
Inductance 1 KHz  
Test  
Frequency  
(MHz)  
I rms  
Max.  
(A)  
I sat  
Typ.  
(A)  
SRF  
Min.  
RDC  
Max.  
(Ω)  
Q
Bourns Part No.  
SRR0604-1R5ML  
SRR0604-2R2ML  
SRR0604-2R5ML  
SRR0604-3R3ML  
SRR0604-4R7ML  
SRR0604-6R8ML  
SRR0604-100ML  
SRR0604-150ML  
SRR0604-220ML  
SRR0604-330KL  
SRR0604-470KL  
SRR0604-680KL  
SRR0604-101KL  
SRR0604-151KL  
SRR0604-221KL  
SRR0604-331KL  
SRR0604-471KL  
SRR0604-681KL  
SRR0604-102KL  
SRR0604-222KL  
uH  
1.5  
2.2  
2.5  
3.3  
4.7  
6.8  
10  
Tol. %  
20  
20  
20  
20  
20  
20  
20  
20  
20  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
10  
Ref.  
(MHz)  
................................-40 °C to +125 °C  
(Temperature rise included)  
23  
21  
21  
21  
10  
20  
18  
18  
16  
16  
15  
15  
23  
21  
20  
18  
18  
16  
15  
80  
7.96  
7.96  
7.96  
7.96  
7.96  
7.96  
2.52  
2.52  
2.52  
110.0  
100.0  
100.0  
90.0  
50.0  
37.0  
30.0  
30.0  
25.0  
21.0  
18.0  
15.0  
13.0  
12.0  
10.0  
7.0  
0.028  
0.032  
0.035  
0.050  
0.060  
0.070  
0.12  
0.13  
0.19  
0.25  
0.36  
0.52  
0.65  
1.00  
1.70  
2.10  
3.30  
4.80  
6.10  
16.0  
2.80  
2.50  
2.50  
2.30  
2.00  
1.60  
1.30  
1.10  
0.90  
0.70  
0.60  
0.50  
0.40  
0.30  
0.25  
0.20  
0.18  
0.15  
0.12  
0.10  
3.95  
3.50  
3.50  
2.90  
2.55  
2.05  
1.80  
1.45  
1.20  
0.95  
0.80  
0.68  
0.57  
0.47  
0.32  
0.28  
0.22  
0.19  
0.15  
0.08  
Storage Temperature  
................................-40 °C to +125 °C  
Resistance to Soldering Heat  
.................................260 °C for 5 sec.  
Materials  
Core............................... Ferrite DR & RI  
Wire ............................Enameled copper  
Base .....................................LCP E4008  
Terminal....................................Cu/Ni/Sn  
Rated Current  
15  
22  
33  
47  
2.52  
2.52  
2.52  
...............Ind. drop of 10 % typ. at Isat  
Temperature Rise  
68  
100  
150  
220  
330  
470  
680  
1000  
2200  
0.796  
0.796  
0.796  
0.796  
0.796  
0.796  
0.252  
0.252  
.....................40 °C max. at rated Irms  
Packaging.................. 1000 pcs. per reel  
Product Dimensions  
6.5  
6.0  
5.5  
0.65  
6.5 ± 0.2  
(.256 ±.008)  
6.5 ±0.2  
(.256 ±.008)  
4.8  
(.189)  
MAX.  
100  
Schematic  
2.0 ±0.2  
(.099 ±.008)  
0.7 ±0.1  
(.028 ±.004)  
5.0 ±0.2  
(.197 ±.008)  
0.7 ±0.1  
(.028 ±.004)  
Recommended Layout  
2.5  
(.099)  
4.5  
(.177)  
1.5  
(.060)  
MM  
DIMENSIONS:  
(INCHES)  
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  

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