Datasheet > SR850

SR850

更新时间： 2024-11-10 22:42:47

品牌	Logo	应用领域
商朗 - LUNSURE		二极管局域网
页数	文件大小	规格书
2页	156K
描述
SCHOTTKY BARRIER RECTIFIER

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中文翻译

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数据手册

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SR850 数据手册

SR820 THRU SR8A0(SINGLE CHIP)

CHENYI ELECTRONICS

SCHOTTKY BARRIER RECTIFIER

Reverse Voltage - 20 to 100 Volts

Forward Current - 8.0Amperes

FEATURES

. Plastic package has Underwriters Laboratory Flammability Classification 94V-0

. Metal sliicon junction ,majority carriet conduction

. Guard ring for overcoltage protection

. Low power loss,high efficiency

. High current capability ,Low forward voltage drop

. Single rectifier construction

. High surge capability

. For use in low voltage ,high frequency inverters,

free wheeling , and polarilty protection applications

. High temperature soldering guaranteed: 250 /10 seconds

0.25"(6.35mm)from case

MECHANICAL DATA

. Case: JEDEC DO-220AC molded plastic body

. Terminals: lead solderable per MIL-STD-750,method 2026

. Polarity: As marked

. Mounting Position: Any

. Weight: 0.08 ounce, 2.24 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

(Ratings at 25 ambient temperature unless otherwise specified,Single phase,half wave,resistive or inductive)

load. For capacitive load,derate by 20%)

Symbols SR820 SR830 SR840 SR850 SR860 SR880 SR8A0

Units

Volts

Maximum repetitive peak reverse voltage

Maximum RMS voltage

VRRM

VRMS

VDC

100

Maximum DC blocking voltage

100

Macimum average forward rectified

current(see Fig.1)

I(AV)

IFRM

8.0

Amps

Repetitive peak forward current(square wavr,

20KHz) at Tc=105

16.0

Peak forward surge current 8.3ms singel half

sine-wave superimposed on rated load

(JEDEC method)

IFSM

150.0

Amps

0.65

0.75

0.8

0.85

Maximum instantaneous forward voltage at 7.5 A(Note 1)

Volts

1.0

2.5

Maximum instantaneous reverse

TA=25

TA=125

current at rated DC blocking voltage(Note 1)

Typeical thermal resistance(Note 2)

-65 to +150

Operating junction temperature range

storage temperature range

-65 to +150

TSTG

Notes: 1. Pulse test: 300

pulse width,1% duty cycle

2.Thermal resistance from juntion to case

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