SPM1004
12V Input 6A Output Power Supply in Inductor (PSI2) Module
FEATURES
DESCRIPTION
Integrated Point of Load power module using PSI2
Power Supply in Inductor technology
Small footprint, low-profile, 15mm x 9mm x 3mm,
with LGA Package (with 0.63 mm pads)
Efficiency of 95.2% at 3A and 94.2% at 6A for 5V
output
SPM1004 is an easy-to-use 6A output integrated Point of
Load (POL) power supply module. It contains integrated
power MOSFETs, driver, PWM controller,
a high
performance inductor, input and output capacitors and
other passive components in one low profile LGA package
using PSI2 technology.
High output current, 6A without derating at 85°C
ambient with no air flow
Wide output voltage selections: from 0.8V to 5V
output voltages with ±10% trim capability
Output voltage remote sensing
Only one external input capacitor and one external output
capacitor are needed for typical applications. There is no
need for loop compensation, sensitive PCB layout,
inductor selection, or in-circuit production testing.
SPM1004 integrated POL power module series are offered
with eight models for eight different output voltages:
5.0V, 3.3V, 2.5V, 1.8V, 1.5V, 1.2V, 1.0V, and 0.8V. Each
output voltage can be trimmed by ±10%.
Pre-bias startup capability
Adjustable soft-start time
Enable signal input and Power Good signal output
Programmable Under Voltage Lock Out (UVLO)
Output Over-Current Protection (OCP)
Operating temperature range -40°C to 85°C
Qualified to IPC9592B, Class II
All SPM1004 models deliver full 6A load current without
derating at 85°C ambient temperature with no airflow.
Small size (15mm x 9mm) and low profile (3mm) allows
SPM1004 to be placed very close to its load or on the back
side of the PCB for high density applications.
MSL 3 and RoHS compliant
Constant-on-time (COT) control is used to achieve
excellent transient response to line and load changes
without sacrificing stability and high efficiency at light
load.
Sumida's PSI2 technology ensures optimal inductor design,
uniform temperature distribution and very low
temperature difference between case and IC die.
APPLICATIONS
Broadband and communications equipment
DSP and FPGA Point of Load applications
High density distributed power systems
Systems using PCI / PCI express / PXI express
Automated test and medical equipment
SIMPLIFIED APPLICATION
EFFICIENCY VS LOAD CURRENT (VIN = 12V)
97
96
95
94
93
VAUX
PVIN
PWRGD
SS
VSENSE
VOUT
VOUT
VIN
CIN
SPM1004
COUT
EN
VADJ
92
Vout = 5.0 V
AGND
PGND
PHASE
91
Vout = 3.3 V
90
0
1
2
3
4
5
6
Output Current (A)
Version 3.3
February 19, 2016
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