是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LEAD FREE, 12 X 12 MM, 1.70 MM HEIGHT, LFBGA-180 |
针数: | 180 | Reach Compliance Code: | compliant |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.84 |
其他特性: | ALSO REQUIRES 3.3V SUPPLY | 地址总线宽度: | 23 |
边界扫描: | YES | 总线兼容性: | USB |
最大时钟频率: | 25 MHz | 最大数据传输速率: | 12.5 MBps |
外部数据总线宽度: | 16 | JESD-30 代码: | S-PBGA-B180 |
JESD-609代码: | e1 | 长度: | 12 mm |
低功率模式: | NO | 串行 I/O 数: | 1 |
端子数量: | 180 | 最高工作温度: | 105 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA180,14X14,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.7 mm |
子类别: | Other Microprocessor ICs | 最大供电电压: | 1.98 V |
最小供电电压: | 1.62 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 12 mm | uPs/uCs/外围集成电路类型: | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SPEAR-09-B042 | STMICROELECTRONICS |
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SPEAr㈢ BASIC ARM 926EJ-S core, customizable l | |
SPEAR-09-H020 | STMICROELECTRONICS |
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IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,CMOS,BGA,420PIN | |
SPEAR-09-H022 | STMICROELECTRONICS |
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SPEAr Head ARM 926, 200K customizable eASIC gates, large IP portfolio SoC | |
SPEAR-09-H022_06 | STMICROELECTRONICS |
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SPEAr Head200 ARM 926, 200K customizable eASIC gates, large IP portfolio SoC | |
SPEAR-09-H042 | STMICROELECTRONICS |
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SPEAr⑩ Head200, ARM 926, 200 K customizable e | |
SPEAR-09-H122 | STMICROELECTRONICS |
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SPEAr TM Head600 | |
SPEAR-09-H122_08 | STMICROELECTRONICS |
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SPEAr⑩ Head600 | |
SPEAR-09-L0 | STMICROELECTRONICS |
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SPEAR-09-L0 | |
SPEAR-09-P022 | STMICROELECTRONICS |
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SPEAr⑩ Plus600 dual processor cores | |
SPEAR1310 | STMICROELECTRONICS |
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Dual-core Cortex A9 embedded MPU for communications |