品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | ![]() |
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页数 | 文件大小 | 规格书 |
66页 | 923K | ![]() |
描述 | ||
SPEAr㈢ BASIC ARM 926EJ-S core, customizable logic, large IP portfolio SoC |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | LFBGA, BGA289,17X17,32 | 针数: | 289 |
Reach Compliance Code: | compliant | HTS代码: | 8542.31.00.01 |
风险等级: | 5.75 | 地址总线宽度: | |
边界扫描: | NO | 最大时钟频率: | 24 MHz |
通信协议: | ASYNC, BIT | 数据编码/解码方法: | NRZ |
最大数据传输速率: | 12.5 MBps | 外部数据总线宽度: | |
JESD-30 代码: | S-PBGA-B289 | 长度: | 15 mm |
低功率模式: | YES | 串行 I/O 数: | 1 |
端子数量: | 289 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA289,17X17,32 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
电源: | 1.2,2.5,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 1.7 mm | 子类别: | Other Microprocessor ICs |
最大供电电压: | 1.26 V | 最小供电电压: | 1.14 V |
标称供电电压: | 1.2 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 宽度: | 15 mm |
uPs/uCs/外围集成电路类型: | SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SPEAR-09-H020 | STMICROELECTRONICS |
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IC,PERIPHERAL (MULTIFUNCTION) CONTROLLER,CMOS,BGA,420PIN |
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SPEAR-09-H022 | STMICROELECTRONICS |
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SPEAr Head ARM 926, 200K customizable eASIC gates, large IP portfolio SoC |
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SPEAR-09-H022_06 | STMICROELECTRONICS |
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SPEAr Head200 ARM 926, 200K customizable eASIC gates, large IP portfolio SoC |
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SPEAR-09-H042 | STMICROELECTRONICS |
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SPEAr⑩ Head200, ARM 926, 200 K customizable e |
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SPEAR-09-H122 | STMICROELECTRONICS |
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SPEAr TM Head600 |
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SPEAR-09-H122_08 | STMICROELECTRONICS |
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SPEAr⑩ Head600 |
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SPEAR-09-L0 | STMICROELECTRONICS |
获取价格 |
SPEAR-09-L0 |
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SPEAR-09-P022 | STMICROELECTRONICS |
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SPEAr⑩ Plus600 dual processor cores |
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SPEAR1310 | STMICROELECTRONICS |
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Dual-core Cortex A9 embedded MPU for communications |
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SPEAR1310-2 | STMICROELECTRONICS |
获取价格 |
SPEAR1310-2 |
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