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SPC5643LF2MLQ8 PDF预览

SPC5643LF2MLQ8

更新时间: 2024-10-29 15:17:15
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
136页 1175K
描述
NXP 32-bit MCU, Dual Power Arch, 1MB Flash, 80MHz, -40/+125degC, Automotive Grade, QFP 144

SPC5643LF2MLQ8 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:TransferredReach Compliance Code:compliant
ECCN代码:3A991.A.2HTS代码:8542.31.00.01
风险等级:5.7Is Samacsys:N
位大小:32CPU系列:E200
JESD-30 代码:S-PQFP-G144JESD-609代码:e3
湿度敏感等级:3端子数量:144
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:QFP
封装等效代码:QFP144,.87SQ,20封装形状:SQUARE
封装形式:FLATPACK峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
RAM(字节):131072ROM(单词):1048576
ROM可编程性:FLASH筛选级别:AEC-Q100
速度:80 MHz子类别:Microcontrollers
最大压摆率:280 mA标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:AUTOMOTIVE端子面层:Matte Tin (Sn)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
uPs/uCs/外围集成电路类型:MICROCONTROLLERBase Number Matches:1

SPC5643LF2MLQ8 数据手册

 浏览型号SPC5643LF2MLQ8的Datasheet PDF文件第2页浏览型号SPC5643LF2MLQ8的Datasheet PDF文件第3页浏览型号SPC5643LF2MLQ8的Datasheet PDF文件第4页浏览型号SPC5643LF2MLQ8的Datasheet PDF文件第5页浏览型号SPC5643LF2MLQ8的Datasheet PDF文件第6页浏览型号SPC5643LF2MLQ8的Datasheet PDF文件第7页 
NXP Semiconductors  
Data Sheet: Technical Data  
Document Number: MPC5643L  
Rev. 10, 11/2021  
MPC5643L  
144 LQFP  
MPC5643L Microcontroller  
Data Sheet  
257 MAPBGA  
(20 x 20 x 1.4 mm)  
(14 x 14 x 0.8 mm)  
Cyclic redundancy check (CRC) unit  
High-performance e200z4d dual core  
Decoupled Parallel mode for high-performance use of  
replicated cores  
Nexus Class 3+ interface  
Interrupts  
GPIOs individually programmable as input, output or  
special function  
Three 6-channel general-purpose eTimer units  
2 FlexPWM units  
32-bit Power Architecture® technology CPU  
Core frequency as high as 120 MHz  
Dual issue five-stage pipeline core  
Variable Length Encoding (VLE)  
Memory Management Unit (MMU)  
4 KB instruction cache with error detection code  
Signal processing engine (SPE)  
Replicated 16-priority controller  
Replicated 16-channel eDMA controller  
Memory available  
1 MB flash memory with ECC  
128 KB on-chip SRAM with ECC  
Built-in RWW capabilities for EEPROM emulation  
Four 16-bit channels per module  
Communications interfaces  
SIL3/ASILD innovative safety concept: LockStep mode and  
Fail-safe protection  
2 LINFlexD channels  
3 DSPI channels with automatic chip select  
generation  
2 FlexCAN interfaces (2.0B Active) with 32  
message objects  
FlexRay module (V2.1 Rev. A) with 2 channels,  
64 message buffers and data rates up to 10 Mbit/s  
Sphere of replication (SoR) for key components (such as  
CPU core, eDMA, crossbar switch)  
Fault collection and control unit (FCCU)  
Redundancy control and checker unit (RCCU) on outputs  
of the SoR connected to FCCU  
Boot-time Built-In Self-Test for Memory (MBIST) and  
Logic (LBIST) triggered by hardware  
Boot-time Built-In Self-Test for ADC and flash memory  
triggered by software  
Two 12-bit analog-to-digital converters (ADCs)  
16 input channels  
Programmable cross triggering unit (CTU) to  
synchronize ADCs conversion with timer and  
PWM  
Replicated safety enhanced watchdog  
Replicated junction temperature sensor  
Non-maskable interrupt (NMI)  
16-region memory protection unit (MPU)  
Clock monitoring units (CMU)  
Sine wave generator (D/A with low pass filter)  
On-chip CAN/UART bootstrap loader  
Single 3.0 V to 3.6 V voltage supply  
Ambient temperature range –40 °C to 125 °C  
Junction temperature range –40 °C to 150 °C  
Power management unit (PMU)  
NXP reserves the right to change the production detail specifications as may be  
required to permit improvements in the design of its products.  

SPC5643LF2MLQ8 替代型号

型号 品牌 替代类型 描述 数据表
MPXS2005VLQ80 NXP

完全替代

32-BIT, FLASH, 80MHz, MICROCONTROLLER, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH,
MPXS2010VLQ80 NXP

完全替代

32-BIT, FLASH, 80MHz, MICROCONTROLLER, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, 0.50 MM PITCH,

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