Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MPC5604BC
Rev. 11.1, 10/2013
MPC5604B/C
MAPBGA–225
QFN12
##_mm_x_##mm
(20 x 20 x 1.4 mm)
144 LQFP
208 MAPBGA
15 mm x 15 mm
(17 x 17 x 1.7 mm)
SOT-343R
PKG-TBD
MPC5604B/C
Microcontroller Data Sheet
##_mm_x_##mm
## mm x ## mm
100 LQFP
64 LQFP
TBD
(14 x 14 x 1.4 mm)
(10 x 10 x 1.4 mm)
1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1 Document overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package pinouts and signal descriptions. . . . . . . . . . . . . . . . . 8
3.1 Package pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 Pad configuration during reset phases. . . . . . . . . . . . . 11
3.3 Voltage supply pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.4 Pad types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.5 System pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.6 Functional ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.7 Nexus 2+ pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.8 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . 29
3.9 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
3.10 Parameter classification . . . . . . . . . . . . . . . . . . . . . . . . 30
3.11 NVUSRO register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
3.12 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . 32
3.13 Recommended operating conditions . . . . . . . . . . . . . . 33
3.14 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . 35
3.15 I/O pad electrical characteristics. . . . . . . . . . . . . . . . . . 36
3.16 RESET electrical characteristics . . . . . . . . . . . . . . . . . 46
3.17 Power management electrical characteristics . . . . . . . 48
3.18 Power consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
3.19 Flash memory electrical characteristics . . . . . . . . . . . . 56
3.20 Electromagnetic compatibility (EMC) characteristics . . 58
3.21 Fast external crystal oscillator (4 to 16 MHz) electrical
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
3.22 Slow external crystal oscillator (32 kHz) electrical
Features
•
Single issue, 32-bit CPU core complex (e200z0)
®
—
—
Compliant with the Power Architecture embedded category
Includes an instruction set enhancement allowing variable
length encoding (VLE) for code size footprint reduction. With
the optional encoding of mixed 16-bit and 32-bit instructions, it
is possible to achieve significant code size footprint reduction.
2
3
•
Up to 512 KB on-chip code flash supported with the flash controller
and ECC
64 (4 × 16) KB on-chip data flash memory with ECC
Up to 48 KB on-chip SRAM with ECC
Memory protection unit (MPU) with 8 region descriptors and 32-byte
region granularity
Interrupt controller (INTC) with 148 interrupt vectors, including 16
external interrupt sources and 18 external interrupt/wakeup sources
Frequency modulated phase-locked loop (FMPLL)
Crossbar switch architecture for concurrent access to peripherals, flash
memory, or RAM from multiple bus masters
Boot assist module (BAM) supports internal flash programming via a
serial link (CAN or SCI)
Timer supports input/output channels providing a range of 16-bit input
capture, output compare, and pulse width modulation functions
(eMIOS-lite)
•
•
•
•
•
•
•
•
•
•
•
•
10-bit analog-to-digital converter (ADC)
3 serial peripheral interface (DSPI) modules
Up to 4 serial communication interface (LINFlex) modules
Up to 6 enhanced full CAN (FlexCAN) modules with configurable
buffers
2
•
•
1 inter IC communication interface (I C) module
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
3.23 FMPLL electrical characteristics. . . . . . . . . . . . . . . . . . 65
3.24 Fast internal RC oscillator (16 MHz) electrical
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
3.25 Slow internal RC oscillator (128 kHz) electrical
Up to 123 configurable general purpose pins supporting input and
output operations (package dependent)
Real Time Counter (RTC) with clock source from 128 kHz or 16 MHz
internal RC oscillator supporting autonomous wakeup with 1 ms
resolution with max timeout of 2 seconds
•
•
•
•
Up to 6 periodic interrupt timers (PIT) with 32-bit counter resolution
1 System Module Timer (STM)
Nexus development interface (NDI) per IEEE-ISTO 5001-2003 Class
Two Plus standard
Device/board boundary Scan testing supported with per Joint Test
Action Group (JTAG) of IEEE (IEEE 1149.1)
On-chip voltage regulator (VREG) for regulation of input supply for
all internal levels
characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
3.26 ADC electrical characteristics. . . . . . . . . . . . . . . . . . . . 69
3.27 On-chip peripherals . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
4.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . 86
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
4
•
•
5
6
Appendix AAbbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
This document contains information on a product under development. Freescale reserves
the right to change or discontinue this product without notice.
© Freescale Semiconductor, Inc., 2009-2013. All rights reserved.
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