Datasheet > SOT684-2

SOT684-2

更新时间： 2024-11-17 22:27:51

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
1页	15K
描述
Package outline

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中文翻译

获取价格

数据手册

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SOT684-2 数据手册

PDF: 2002 Oct 23

Philips Semiconductors

Package outline

HVQFN56: plastic thermal enhanced very thin quad flat package; no leads;

56 terminals; body 8 x 8 x 0.85 mm

SOT684-2

terminal 1

index area

detail X

1/2 e

terminal 1

index area

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

UNIT

max.

0.05 0.30

0.00 0.18

8.1

7.9

5.35

5.05

8.1

7.9

5.35

5.05

0.5

0.3

0.2

0.5

6.5

0.05

0.1

0.05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

02-04-24

02-10-22

SOT684-2

- - -

MO-220

- - -

中文翻译

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