Datasheet > SOT685-1

SOT685-1

更新时间： 2024-11-19 22:27:51

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
1页	14K
描述
Package outline

阅读下载

中文翻译

获取价格

数据手册

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SOT685-1 数据手册

PDF: 2002 Nov 27

Philips Semiconductors

Package outline

HVSON8: plastic thermal enhanced very thin small outline package; no leads;

8 terminals; body 6 x 5 x 0.85 mm

SOT685-1

2.5

5 mm

scale

detail X

terminal 1

index area

terminal 1

index area

exposed tie bar (4×)

DIMENSIONS (mm are the original dimensions)

(1)

UNIT

max.

0.05

0.00

0.5

0.3

5.15 3.95 6.15 3.65

4.85 3.65 5.85 3.35

0.75

0.50

0.05

0.1

0.2

1.27

3.81 0.35

0.1

0.05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

02-08-12

02-11-27

SOT685-1

- - -

中文翻译

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