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SNJ5417J PDF预览

SNJ5417J

更新时间: 2024-11-05 22:42:55
品牌 Logo 应用领域
德州仪器 - TI 输出元件高压驱动
页数 文件大小 规格书
13页 474K
描述
HEX BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS

SNJ5417J 数据手册

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ꢈꢉ ꢊ ꢋꢌꢍ ꢍ ꢉꢎꢀ ꢏ ꢐꢎ ꢑ ꢒꢉ ꢎ  
SDLS032G − DECEMBER 1983 − REVISED MAY 2004  
SN5407, SN5417 . . . J OR W PACKAGE  
SN7407, SN7417 . . . D, N, OR NS PACKAGE  
(TOP VIEW)  
D
D
D
D
D
Convert TTL Voltage Levels to MOS Levels  
High Sink-Current Capability  
Input Clamping Diodes Simplify System  
Design  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
V
1A  
1Y  
2A  
2Y  
3A  
CC  
6A  
6Y  
5A  
5Y  
4A  
4Y  
Open-Collector Driver for Indicator Lamps  
and Relays  
Inputs Fully Compatible With Most TTL  
Circuits  
3Y  
GND  
8
description/ordering information  
These TTL hex buffers/drivers feature  
high-voltage open-collector outputs for interfacing  
with high-level circuits (such as MOS) or for  
driving high-current loads (such as lamps or  
relays) and also are characterized for use as  
buffers for driving TTL inputs. The SN5407 and  
SN7407 have minimum breakdown voltages of  
30 V, and the SN5417 and SN7417 have  
minimum breakdown voltages of 15 V. The  
maximum sink current is 30 mA for the SN5407  
and SN5417 and 40 mA for the SN7407 and  
SN7417.  
SN5407 . . . FK PACKAGE  
(TOP VIEW)  
3
2
1 20 19  
18  
6Y  
NC  
5A  
2A  
NC  
2Y  
4
5
6
7
8
17  
16  
15 NC  
14  
NC  
3A  
5Y  
9 10 11 12 13  
These devices perform the Boolean function  
Y = A in positive logic.  
NC − No internal connection  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
Tube  
SN7407D  
7407  
7417  
Tape and reel  
Tube  
SN7407DR  
SN7417D  
SOIC − D  
Tape and reel  
SN7417DR  
SN7407N  
0°C to 70°C  
SN7407N  
SN7417N  
SN7407  
PDIP − N  
Tube  
SN7417N  
SN7407NSR  
SN7417NSR  
SNJ5407J  
SNJ5417J  
SNJ5407W  
SNJ5407FK  
SOP − NS  
Tape and reel  
SN7417  
SNJ5407J  
SNJ5417J  
SNJ5407W  
SNJ5407FK  
CDIP − J  
CFP − W  
Tube  
Tube  
−55°C to 125°C  
LCCC − FK Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB  
design guidelines are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2004, Texas Instruments Incorporated  
ꢕ ꢝ ꢨ ꢠ ꢟꢫ ꢦꢥ ꢣꢤ ꢥꢟ ꢡꢨ ꢪꢜ ꢢꢝ ꢣ ꢣꢟ ꢲꢑ ꢙꢗ ꢖꢎ ꢍ ꢗꢳꢴꢂ ꢳꢂꢆ ꢢꢪꢪ ꢨꢢ ꢠ ꢢ ꢡꢧ ꢣꢧꢠ ꢤ ꢢ ꢠ ꢧ ꢣꢧ ꢤꢣꢧ ꢫ  
ꢣ ꢧ ꢤ ꢣꢜ ꢝꢱ ꢟꢞ ꢢ ꢪꢪ ꢨꢢ ꢠ ꢢ ꢡ ꢧ ꢣ ꢧ ꢠ ꢤ ꢬ  
ꢦ ꢝꢪ ꢧꢤꢤ ꢟ ꢣꢭꢧ ꢠ ꢯꢜ ꢤꢧ ꢝ ꢟꢣꢧ ꢫꢬ ꢕ ꢝ ꢢꢪ ꢪ ꢟ ꢣꢭꢧ ꢠ ꢨꢠ ꢟ ꢫꢦꢥ ꢣꢤ ꢆ ꢨꢠ ꢟ ꢫꢦꢥ ꢣꢜꢟ ꢝ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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