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ꢅ ꢉꢊ ꢋ ꢌ ꢃ ꢍ ꢃ ꢉꢊ ꢎꢏ ꢐꢋꢑ ꢄ ꢒꢓꢁ ꢁꢔꢐ ꢕꢀ ꢉꢆꢅ ꢆ ꢄꢌ ꢎ ꢖꢓꢋ ꢑꢗꢐ ꢔ ꢐ ꢑꢁꢔ ꢘꢕꢑ ꢊꢔ ꢕꢙꢕꢔ ꢄꢔ ꢑ ꢊ ꢔꢕ
SLLS540B − JULY 2002 − REVISED NOVEMBER 2004
D, DB, DW, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
D
D
D
D
Operate With 3-V to 5.5-V V
Operate Up To 1 Mbit/s
Supply
CC
Low Supply Current . . . 300 µA Typ
External Capacitors . . . 4 × 0.1 µF
C1+
V+
V
CC
15 GND
1
2
3
4
5
6
7
8
16
14
13
12
11
10
9
C1−
C2+
C2−
V−
DOUT1
RIN1
Accept 5-V Logic Input With 3.3-V Supply
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ROUT1
DIN1
RS-232 Bus-Pin ESD Protection Exceeds
15 kV Using Human-Body Model (HBM)
DOUT2
RIN2
DIN2
ROUT2
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Laptops, Palmtop PCs, and
Hand-Held Equipment
description/ordering information
The SN65C3232 and SN75C3232 consist of two line drivers, two line receivers, and a dual charge-pump circuit
with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). These devices provide the
electrical interface between an asynchronous communication controller and the serial-port connector. The
charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices
operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/µs to 150 V/µs.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
Tube of 40
SN65C3232D
SOIC − D
65C3232
Reel of 2500
Tube of 40
SN65C3232DR
SN65C3232DW
SN65C3232DWR
SN65C3232DBR
SN65C3232PW
SN65C3232PWR
SN75C3232D
SOIC − DW
SSOP − DB
65C3232
65C3232
Reel of 2000
Reel of 2000
Tube of 90
−40°C to 85°C
TSSOP − PW
SOIC − D
CB3232
Reel of 2000
Tube of 40
75C3232
Reel of 2500
Tube of 40
SN75C3232DR
SN75C3232DW
SN75C3232DWR
SN75C3232DBR
SN75C3232PW
SN75C3232PWR
SOIC − DW
SSOP − DB
75C3232
75C3232
Reel of 2000
Reel of 2000
Tube of 90
0°C to 70°C
TSSOP − PW
CA3232
Reel of 2000
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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