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SN74LVC2G240DCU PDF预览

SN74LVC2G240DCU

更新时间: 2024-11-21 13:13:51
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SN74LVC2G240DCU 数据手册

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SN74LVC2G240  
DUAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCES208HAPRIL 1999REVISED FEBRUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Typical VOHV (Output VOH Undershoot) >2 V at  
VCC = 3.3 V, TA = 25°C  
Supports 5-V VCC Operation  
Ioff Supports Partial-Power-Down Mode  
Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4.6 ns at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 3.3 V, TA = 25°C  
DCT PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
DCU PACKAGE  
(TOP VIEW)  
4 5  
GND  
2Y  
2A  
1Y  
VCC  
2OE  
1Y  
1
2
3
4
8
7
6
5
1OE  
1A  
VCC  
2OE  
1Y  
1
2
3
4
8
7
6
5
1OE  
1A  
3 6  
2 7  
1 8  
1A  
2OE  
VCC  
2Y  
1OE  
GND  
2A  
2Y  
GND  
2A  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC2G240 is designed specifically to improve the performance and density of 3-state memory  
address drivers, clock drivers, and bus-oriented receivers and transmitters.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
Reel of 3000  
SN74LVC2G240YZPR  
_ _ _CK_  
–40°C to 85°C  
SSOP – DCT  
Reel of 3000  
Reel of 3000  
SN74LVC2G240DCTR  
SN74LVC2G240DCUR  
C40_ _ _  
C40_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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