SN74LVC1404
OSCILLATOR DRIVER
FOR CRYSTAL OSCILLATOR OR CERAMIC RESONATOR
www.ti.com
SCES469C–AUGUST 2003–REVISED JULY 2005
FEATURES
•
Available in the Texas Instruments
•
Low Power Consumption (10-µA Max ICC) in
NanoStar™ and NanoFree™ Packages
Standby State
•
•
•
Supports 5-V VCC Operation
•
•
±24-mA Output Drive at 3.3 V
Inputs Accept Voltages to 5.5 V
Ioff Supports Partial-Power-Down Mode
Operation
One Buffered Inverter With Schmitt-Trigger
Input and Two Unbuffered Inverters
•
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
•
Integrated Solution for Oscillator Applications
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Suitable for Commonly Used Clock
Frequencies:
– 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,
25 MHz, 26 MHz, 27 MHz, 28 MHz
– 1000-V Charged-Device Model (C101)
•
Control Input to Disable the Oscillator Circuit
YEP OR YZP PACKAGE
(BOTTOM VIEW)
DCT PACKAGE
(TOP VIEW)
DCU PACKAGE
(TOP VIEW)
4 5
Y
A
GND
XIN
XOUT
CTRL
CTRL
XOUT
XIN
V
CC
1
2
3
4
8
7
6
5
3 6
1
2
8
7
CTRL
XOUT
V
CC
OSCOUT
A
Y
2
7
OSCOUT
1 8
V
CC
OSCOUT
GND
3
4
6
5
XIN
A
Y
GND
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This device consists of one inverter with a Schmitt-trigger input and two unbuffered inverters. It is designed for
1.65-V to 5.5-V VCC operation.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
SN74LVC1404YEPR
Tape and reel
_ _ _44_
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
(Pb-free)
SN74LVC1404YZPR
–40°C to 85°C
SSOP – DCT
Tape and reel SN74LVC1404DCTR
Tape and reel SN74LVC1404DCUR
CA4_ _ _
CA4_
VSSOP – DCU
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.