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SN74LVC1404DCUR PDF预览

SN74LVC1404DCUR

更新时间： 2024-02-22 01:45:51
品牌 Logo 应用领域
德州仪器 - TI 振荡器陶瓷谐振器驱动
页数 文件大小 规格书
16页 305K
描述
OSCILLATOR DRIVER FOR CRYSTAL OSCILLATOR OR CERAMIC RESONATOR

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SN74LVC1404DCUR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：BGA
包装说明：DSBGA-8针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1.53Samacsys Confidence：4
Samacsys Status：Released2D Presentation：https://componentsearchengine.com/2D/0T/5701.2.3.png
Schematic Symbol：https://componentsearchengine.com/symbol.php?partID=5701PCB Footprint：https://componentsearchengine.com/footprint.php?partID=5701
3D View：https://componentsearchengine.com/viewer/3D.php?partID=5701Samacsys PartID：5701
Samacsys Image：https://componentsearchengine.com/Images/9/SN74LVC1404YZPR.jpgSamacsys Thumbnail Image：https://componentsearchengine.com/Thumbnails/2/SN74LVC1404YZPR.jpg
Samacsys Pin Count：8Samacsys Part Category：Integrated Circuit
Samacsys Package Category：BGASamacsys Footprint Name：YZP (R-XBGA-N8)
Samacsys Released Date：2015-11-26 09:35:24Is Samacsys：N
系列：LVC/LCX/ZJESD-30 代码：R-XBGA-B8
JESD-609代码：e1长度：1.9 mm
负载电容（CL）：50 pF逻辑集成电路类型：INVERTER/BUFFER
最大I（ol）：0.032 A湿度敏感等级：1
功能数量：2输入次数：1
端子数量：8最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装代码：VFBGA封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法：TR
峰值回流温度（摄氏度）：260最大电源电流（ICC）：0.04 mA
Prop。Delay @ Nom-Sup：8 ns传播延迟（tpd）：25.7 ns
认证状态：Not Qualified施密特触发器：YES
座面最大高度：0.5 mm最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：1.8 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：0.5 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：0.9 mmBase Number Matches：1

SN74LVC1404DCUR 数据手册

 浏览型号SN74LVC1404DCUR的Datasheet PDF文件第2页浏览型号SN74LVC1404DCUR的Datasheet PDF文件第3页浏览型号SN74LVC1404DCUR的Datasheet PDF文件第4页浏览型号SN74LVC1404DCUR的Datasheet PDF文件第5页浏览型号SN74LVC1404DCUR的Datasheet PDF文件第6页浏览型号SN74LVC1404DCUR的Datasheet PDF文件第7页 
SN74LVC1404  
OSCILLATOR DRIVER  
FOR CRYSTAL OSCILLATOR OR CERAMIC RESONATOR  
www.ti.com  
SCES469C–AUGUST 2003–REVISED JULY 2005  
FEATURES  
•
Available in the Texas Instruments  
•
Low Power Consumption (10-µA Max ICC) in  
NanoStar™ and NanoFree™ Packages  
Standby State  
•
•
•
Supports 5-V VCC Operation  
•
•
±24-mA Output Drive at 3.3 V  
Inputs Accept Voltages to 5.5 V  
Ioff Supports Partial-Power-Down Mode  
Operation  
One Buffered Inverter With Schmitt-Trigger  
Input and Two Unbuffered Inverters  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
•
Integrated Solution for Oscillator Applications  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Suitable for Commonly Used Clock  
Frequencies:  
– 15 kHz, 3.58 MHz, 4.43 MHz, 13 MHz,  
25 MHz, 26 MHz, 27 MHz, 28 MHz  
– 1000-V Charged-Device Model (C101)  
•
Control Input to Disable the Oscillator Circuit  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
4 5  
Y
A
GND  
XIN  
XOUT  
CTRL  
CTRL  
XOUT  
XIN  
V
CC  
1
2
3
4
8
7
6
5
3 6  
1
2
8
7
CTRL  
XOUT  
V
CC  
OSCOUT  
A
Y
2
7
OSCOUT  
1 8  
V
CC  
OSCOUT  
GND  
3
4
6
5
XIN  
A
Y
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This device consists of one inverter with a Schmitt-trigger input and two unbuffered inverters. It is designed for  
1.65-V to 5.5-V VCC operation.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC1404YEPR  
Tape and reel  
_ _ _44_  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
SN74LVC1404YZPR  
–40°C to 85°C  
SSOP – DCT  
Tape and reel SN74LVC1404DCTR  
Tape and reel SN74LVC1404DCUR  
CA4_ _ _  
CA4_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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