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SN74HC630NP3 PDF预览

SN74HC630NP3

更新时间: 2024-11-12 05:36:15
品牌 Logo 应用领域
德州仪器 - TI 光电二极管逻辑集成电路
页数 文件大小 规格书
4页 197K
描述
IC,ERROR DETECTION & CORRECTION (EDAC),HC-CMOS,DIP,28PIN,PLASTIC

SN74HC630NP3 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP28,.6Reach Compliance Code:not_compliant
风险等级:5.92JESD-30 代码:R-PDIP-T28
逻辑集成电路类型:ERROR DETECTION AND CORRECTION CIRCUIT端子数量:28
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装等效代码:DIP28,.6封装形状:RECTANGULAR
封装形式:IN-LINE子类别:Arithmetic Circuits
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL

SN74HC630NP3 数据手册

 浏览型号SN74HC630NP3的Datasheet PDF文件第2页浏览型号SN74HC630NP3的Datasheet PDF文件第3页浏览型号SN74HC630NP3的Datasheet PDF文件第4页 

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