ꢀꢁꢂ ꢃ ꢄ ꢅꢆ ꢂꢇ ꢈꢉ ꢊ ꢋ
ꢌ ꢅꢍꢈꢎ ꢍ ꢏꢈꢁꢀ ꢐꢈꢏꢑ ꢁꢍ ꢒꢉꢍ ꢓꢐ ꢑ ꢎꢈꢍꢅ ꢄ
ꢔ ꢕꢍ ꢄ ꢇ ꢉꢀꢍꢈꢍ ꢑ ꢌ ꢖꢍ ꢐ ꢖꢍꢀ
SCLS600 − NOVEMBER 2004
DW OR PW PACKAGE
(TOP VIEW)
D
Qualification in Accordance With
AEC-Q100
†
D
Qualified for Automotive Applications
OE
1D
2D
3D
4D
5D
6D
7D
8D
V
CC
1Q
2Q
1
2
3
4
5
6
7
8
9
20
19
18
D
Customer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
17 3Q
16 4Q
15 5Q
14 6Q
13 7Q
12 8Q
11 LE
D
D
Wide Operating Voltage Range of 2 V to 6 V
High-Current 3-State Outputs Drive Bus
Lines Directly or up to 15 LSTTL Loads
D
D
D
D
D
Low Power Consumption, 80-µA Max I
Typical t = 21 ns
pd
6-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Bus-Structured Pinout
CC
GND 10
†
Contact factory for details. Q100 qualification data available on
request.
description/ordering information
This octal transparent D-type latch features 3-state outputs designed specifically for driving highly capacitive
or relatively low-impedance loads. It is particularly suitable for implementing buffer registers, I/O ports,
bidirectional bus drivers, and working registers.
While the latch-enable (LE) input is high, the Q outputs respond to the data (D) inputs. When LE is low, the
outputs are latched to retain the data that was set up.
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines
without interface or pullup components.
To ensure the high-impedance state during power up or power down, OE should be tied to V
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
through a pullup
CC
OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered
while the outputs are in the high-impedance state.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
SOIC − DW
Reel of 2500
Reel of 2000
SN74HC573AQDWRQ1 HC573AQ
SN74HC573AQPWRQ1 HC573AQ
−40°C to 125°C
TSSOP − PW
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
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