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SCDS041H − DECEMBER 1997 − REVISED OCTOBER 2003
DBQ, DGV, DW, NS, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
D
5-Ω Switch Connection Between Two Ports
Rail-to-Rail Switching on Data I/O Ports
I
Supports Partial-Power-Down Mode
1
24
23
22
21
20
19
18
17
16
15
14
13
NC
A1
V
CC
off
Operation
2
OE
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
3
A2
A3
A4
A5
Flow-Through Architecture Optimizes PCB
Layout
4
5
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
6
7
A6
A7
A8
A9
8
description/ordering information
9
The SN74CBTLV3861 provides ten bits of
high-speed bus switching. The low on-state
resistance of the switch allows connections to be
made with minimal propagation delay.
10
11
12
A10
GND
NC − No internal connection
The device is organized as one 10-bit bus switch.
When output enable (OE) is low, the 10-bit bus
switch is on, and port A is connected to port B.
When OE is high, the switch is open, and the
high-impedance state exists between the two
ports.
This device is fully specified for partial-power-down applications using I . The I feature ensures that
off
off
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to V
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
through a pullup
CC
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
QSOP − DBQ
SOIC − DW
Tape and reel
Tube
SN74CBTLV3861DBQR
SN74CBTLV3861DW
SN74CBTLV3861DWR
SN74CBTLV3861NSR
SN74CBTLV3861PWR
SN74CBTLV3861DGVR
CL861
CBTLV3861
Tape and reel
Tape and reel
Tape and reel
Tape and reel
−40°C to 85°C
SOP − NS
CBTLV3861
CL861
TSSOP − PW
TVSOP − DGV
CL861
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
FUNCTION TABLE
INPUT
FUNCTION
OE
L
A port = B port
Disconnect
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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