SN54AHCT574, SN74AHCT574
OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH 3-STATE OUTPUTS
SCLS245L – OCTOBER 1995 – REVISED JULY 2003
Inputs Are TTL-Voltage Compatible
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Latch-Up Performance Exceeds 250 mA Per
JESD 17
– 1000-V Charged-Device Model (C101)
SN54AHCT574 . . . J OR W PACKAGE
SN74AHCT574 . . . DB, DGV, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
SN54AHCT574 . . . FK PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE
1D
2D
3D
4D
5D
6D
7D
8D
V
CC
3
2
1 20 19
18
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
CLK
2Q
3Q
4Q
5Q
6Q
3D
4D
5D
6D
7D
4
5
6
7
8
17
16
15
14
9 10 11 12 13
GND
description/ordering information
The ’AHCT574 devices are octal edge-triggered D-type flip-flops that feature 3-state outputs designed
specifically for driving highly capacitive or relatively low-impedance loads. These devices are particularly
suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels of the data (D) inputs.
A buffered output-enable (OE) input places the eight outputs in either a normal logic state (high or low) or the
high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.
The high-impedance state and the increased drive provide the capability to drive bus lines without interface or
pullup components.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP – N
Tube
SN74AHCT574N
SN74AHCT574N
Tube
SN74AHCT574DW
SN74AHCT574DWR
SN74AHCT574NSR
SN74AHCT574DBR
SN74AHCT574PW
SN74AHCT574PWR
SOIC – DW
AHCT574
Tape and reel
Tape and reel
Tape and reel
Tube
SOP – NS
AHCT574
HB574
–40°C to 85°C
SSOP – DB
TSSOP – PW
HB574
Tape and reel
Tape and reel
Tube
TVSOP – DGV
CDIP – J
SN74AHCT574DGVR HB574
SNJ54AHCT574J
SNJ54AHCT574W
SNJ54AHCT574FK
SNJ54AHCT574J
–55°C to 125°C
CFP – W
Tube
SNJ54AHCT574W
SNJ54AHCT574FK
LCCC – FK
Tube
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265