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ꢉ ꢌꢍ ꢎꢁꢏ ꢇ ꢐ ꢊ ꢌꢍ ꢎꢁꢏ ꢑꢏ ꢆꢐꢑ ꢏꢒꢓ ꢑꢏꢔ ꢕꢍꢇꢎ ꢖ ꢍꢏ ꢗꢏ ꢒ
SGDS022A − FEBRUARY 2002 − REVISED APRIL 2008
D OR PW PACKAGE
(TOP VIEW)
D
D
Qualified for Automotive Applications
EPIC (Enhanced-Performance Implanted
CMOS) Process
A
B
V
CC
15 Y0
1
2
3
4
5
6
7
8
16
D
Inputs Are TTL-Voltage Compatible
14
D
Designed Specifically for High-Speed
Memory Decoders and Data-Transmission
Systems
C
Y1
13
12
11
10
9
G2A
G2B
G1
Y2
Y3
Y4
Y5
Y6
D
D
D
Incorporates Three Enable Inputs to
Simplify Cascading and/or Data Reception
Y7
GND
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds 2000 V Per
MIL-STD-833, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
description
The SN74AHCT138Q 3-line to 8-line decoder/demultiplexer is designed to be used in high-performance
memory-decoding and data-routing applications that require very short propagation-delay times. In
high-performance memory systems, this decoder can be used to minimize the effects of system decoding.
When employed with high-speed memories utilizing a fast enable circuit, the delay times of this decoder and
the enable time of the memory usually are less than the typical access time of the memory. This means that
the effective system delay introduced by the decoder is negligible.
The conditions at the binary-select inputs and the three enable inputs select one of eight output lines. Two
active-low and one active-high enable inputs reduce the need for external gates or inverters when expanding.
A 24-line decoder can be implemented without external inverters and a 32-line decoder requires only one
inverter. An enable input can be used as a data input for demultiplexing applications.
{
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
SOIC − D
Tape and reel
Tape and reel
SN74AHCT138QDRQ1
SN74AHCT138QPWRQ1
AHCT138Q
HB138Q
−40°C to 125°C
TSSOP − PW
†
‡
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI web site at http://www.ti.com.
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments.
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Copyright 2008, Texas Instruments Incorporated
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1
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