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SN74AC11IDRQ1 PDF预览

SN74AC11IDRQ1

更新时间: 2024-11-18 12:15:03
品牌 Logo 应用领域
德州仪器 - TI 输入元件
页数 文件大小 规格书
10页 232K
描述
TRIPLE 3-INPUT POSITIVE-AND GATE

SN74AC11IDRQ1 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP, SOP14,.25针数:14
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.27系列:AC
JESD-30 代码:R-PDSO-G14长度:8.65 mm
负载电容(CL):50 pF逻辑集成电路类型:AND GATE
最大I(ol):0.012 A功能数量:3
输入次数:3端子数量:14
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP14,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE包装方法:TAPE AND REEL
峰值回流温度(摄氏度):NOT SPECIFIED电源:2/6 V
Prop。Delay @ Nom-Sup:10 ns传播延迟(tpd):10 ns
认证状态:Not Qualified施密特触发器:NO
筛选级别:AEC-Q100座面最大高度:1.75 mm
子类别:Gates最大供电电压 (Vsup):6 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:1.27 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:3.9 mm
Base Number Matches:1

SN74AC11IDRQ1 数据手册

 浏览型号SN74AC11IDRQ1的Datasheet PDF文件第2页浏览型号SN74AC11IDRQ1的Datasheet PDF文件第3页浏览型号SN74AC11IDRQ1的Datasheet PDF文件第4页浏览型号SN74AC11IDRQ1的Datasheet PDF文件第5页浏览型号SN74AC11IDRQ1的Datasheet PDF文件第6页浏览型号SN74AC11IDRQ1的Datasheet PDF文件第7页 
SN74AC11-Q1  
TRIPLE 3-INPUT POSITIVE-AND GATE  
SCLS523A − AUGUST 2003 − REVISED APRIL 2008  
D PACKAGE  
(TOP VIEW)  
D
D
Qualified for Automotive Applications  
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015; Exceeds 200 V  
Using Machine Model (C = 200 pF, R = 0)  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1A  
1B  
2A  
2B  
2C  
VCC  
1C  
1Y  
3A  
3B  
3C  
3Y  
D
D
D
2-V to 6-V V Operation  
CC  
Inputs Accept Voltages to 6 V  
Max t of 7.5 ns at 5 V  
pd  
2Y  
GND  
description/ordering information  
8
The ’AC11 device contains three independent  
3-input AND gates. This device performs the Boolean function Y = A B C or Y = A + B + C in positive logic.  
{
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
SOIC − D  
Tape and reel  
Tape and reel  
SN74AC11IDRQ1  
AC11IQ1  
AC11IQ1  
−40°C to 85°C  
TSSOP − PW  
SN74AC11IPWRQ1  
For the most current package and ordering information, see the Package Option Addendum at the end of  
this document, or see the TI web site at http://www.ti.com.  
Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging.  
FUNCTION TABLE  
(each gate)  
INPUTS  
OUTPUT  
Y
A
H
L
B
H
X
L
C
H
X
X
L
H
L
L
L
X
X
X
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2008, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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