ꢁꢂꢃ ꢄ ꢅ ꢆꢇ ꢈꢉ ꢃꢊ ꢋꢌ ꢍ
ꢎꢏ ꢐꢐ ꢌꢑ ꢌꢂꢒ ꢏꢊ ꢅ ꢆꢓꢁ ꢒ ꢑꢊꢂꢁ ꢇꢌ ꢏ ꢔꢌ ꢑ
ꢀ
ꢀ
ꢀ
SGLS151C − DECEMBER 2002 − REVISED JULY 2004
D Package
(TOP VIEW)
D
Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
R
RE
DE
D
V
B
A
1
2
3
4
8
7
6
5
CC
D
D
Extended Temperature Performance of
−40°C to 125°C and −55°C to 125°C
Enhanced Diminishing Manufacturing
Sources (DMS) Support
GND
D
D
D
Enhanced Product Change Notification
logic diagram (positive logic)
†
Qualification Pedigree
3
High-Speed Low-Power LinBiCMOS
DE
‡
Circuitry Designed for Signaling Rates Up
4
to 30 Mbps
D
2
D
D
Bus-Pin ESD Protection Exceeds 12-kV
HBM
RE
6
7
A
B
1
Bus
R
Compatible With ANSI Standard
TIA/EIA-485-A and ISO 8482:1987(E)
D
Low Skew
Function Tables
D
Designed for Multipoint Transmission on
Long Bus Lines in Noisy Environments
DRIVER
INPUT
D
H
L
X
ENABLE
OUTPUTS
D
D
Low Disabled Supply Current
Requirements . . . 700 µA Maximum
Common-Mode Voltage Range of −7 V
to 12 V
DE
H
H
L
H
A
H
L
Z
H
B
L
H
Z
L
Open
D
Thermal-Shutdown Protection
D
Driver Positive and Negative Current
Limiting
RECEIVER
DIFFERENTIAL INPUTS
ENABLE
OUTPUT
D
D
D
D
Open-Circuit Fail-Safe Receiver Design
Receiver Input Sensitivity . . . 200 mV Max
Receiver Input Hysteresis . . . 50 mV Typ
V
−V
≥ 0.2 V
ID
≤ −0.2 V
RE
L
L
L
H
L
R
H
?
L
Z
H
A
B
V
ID
−0.2 V < V < 0.2 V
V
ID
X
Glitch-Free Power-Up and Power-Down
Protection
Open
†
‡
H = high level, L = low level, ? = indeterminate,
X = irrelevant, Z = high impedance (off)
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
Signaling rate by TIA/EIA-485-A definition restrict transition times
to 30% of the bit length, and much higher signaling rates may be
achieved without this requirement as displayed in the TYPICAL
CHARACTERISTICS of this device.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinBiCMOS and LinASIC are trademarks of Texas Instruments.
ꢍꢑ ꢕ ꢎꢓ ꢇ ꢒꢏ ꢕ ꢂ ꢎ ꢊꢒꢊ ꢖꢗ ꢘ ꢙꢚ ꢛ ꢜꢝ ꢖꢙꢗ ꢖꢞ ꢟꢠ ꢚ ꢚ ꢡꢗꢝ ꢜꢞ ꢙꢘ ꢢꢠꢣ ꢤꢖꢟ ꢜꢝ ꢖꢙꢗ ꢥꢜ ꢝꢡ ꢦ
ꢍꢚ ꢙ ꢥꢠꢟ ꢝ ꢞ ꢟ ꢙꢗ ꢘꢙ ꢚ ꢛ ꢝ ꢙ ꢞ ꢢꢡ ꢟ ꢖꢘ ꢖꢟꢜ ꢝꢖ ꢙꢗꢞ ꢢꢡ ꢚ ꢝꢧ ꢡ ꢝꢡ ꢚ ꢛꢞ ꢙꢘ ꢒꢡꢨ ꢜꢞ ꢏꢗꢞ ꢝꢚ ꢠꢛ ꢡꢗꢝ ꢞ
ꢞ ꢝ ꢜ ꢗꢥ ꢜ ꢚꢥ ꢩ ꢜ ꢚꢚ ꢜ ꢗ ꢝꢪꢦ ꢍꢚ ꢙ ꢥꢠꢟ ꢝꢖꢙꢗ ꢢꢚ ꢙꢟ ꢡꢞ ꢞꢖ ꢗꢫ ꢥꢙꢡ ꢞ ꢗꢙꢝ ꢗꢡ ꢟꢡ ꢞꢞ ꢜꢚ ꢖꢤ ꢪ ꢖꢗꢟ ꢤꢠꢥ ꢡ
ꢝ ꢡ ꢞ ꢝꢖ ꢗꢫ ꢙꢘ ꢜ ꢤꢤ ꢢꢜ ꢚ ꢜ ꢛ ꢡ ꢝ ꢡ ꢚ ꢞ ꢦ
Copyright 2004, Texas Instruments Incorporated
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