是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LFBGA, |
针数: | 216 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.A.2 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.82 | 总线兼容性: | PCI |
最大时钟频率: | 33 MHz | 外部数据总线宽度: | 32 |
JESD-30 代码: | S-PBGA-B216 | 长度: | 16 mm |
湿度敏感等级: | 3 | 端子数量: | 216 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 250 | 认证状态: | Not Qualified |
座面最大高度: | 1.4 mm | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | CMOS |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 16 mm | uPs/uCs/外围集成电路类型: | BUS CONTROLLER, PCI |
Base Number Matches: | 1 |
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