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SMV0805M PDF预览

SMV0805M

更新时间: 2024-10-28 06:12:51
品牌 Logo 应用领域
台基 - CERAMATE /
页数 文件大小 规格书
9页 247K
描述
Zinc Oxide

SMV0805M 数据手册

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TYPE  
MODEL  
PAGE  
5/9  
SMV0805M□□□KRR  
CITATION  
SUBJECT  
DATE Feb. 03, 2009  
S
o
lde  
ring  
C01  
REV.  
5. SOLDERING RECOMMENDATIONS  
5.1 Recommended solder pad layout  
A
B
C
D
1.0~1.5  
2.6~3.2  
1.2~1.5  
1.1~1.8  
Unitmm)  
5.2 The SIR test of the solder paste shall be done  
5.3 Steel plate and foot distance printing  
Based on JIS-Z-3284  
Foot distance printing (mm)  
> 0.65mm  
Steel Plate thickness (mm)  
0.18mm  
0.65mm~0.5mm  
0.50mm~0.40mm  
<=0.40 mm  
0.15mm  
0.12mm  
0.10mm  
5.4 IR Soldering  
Rapid heating, partial heating or rapid cooling will easily cause defect of the component. So preheating and  
gradual cooling process is suggested. IR soldering has the highest yields due to controlled heating rates and  
solder liquids times. Make sure that the element is not 2.4 The IR reflow and temperature of Soldering for Pb  
Free subjected to a thermal gradient steeper than 4 degrees per second. 2 degrees per second is the ideal  
gradient. During the soldering process, pre- heating to within 100 degrees of the solders peak temperature is  
essential to minimize thermal shock.  

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