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SMUN5330DW PDF预览

SMUN5330DW

更新时间: 2024-11-25 09:18:31
品牌 Logo 应用领域
SECOS 晶体晶体管
页数 文件大小 规格书
28页 330K
描述
NPN / PNP Digital Small Signal Transistor

SMUN5330DW 数据手册

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SMUN5311DW Series  
NPN / PNP  
Digital Small Signal Transistors  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” indicates halogen-free.  
DESCRIPTION  
SOT-363  
The Bias Resistor Transistor (BRT) contains a single transistor with a monolithic  
bias network consisting of two resistors; a series base resistor and a base−emitter  
resistor. These digital transistors are designed to replace a single device and its  
external resistor bias network. The BRT eliminates these individual components by  
integrating them into a single device. In the SMUN5311DW series, two  
A
E
L
complementary BRT devices are housed in the SOT−363 package which is ideal  
for low power surface mount applications where board space is at a premium.  
B
FEATURE  
F
Simplifies circuit design  
Reduces board space  
Reduces component count  
C
H
J
K
D G  
Available in 8 mm, 7 inch/3000 unit tape and reel  
The devices are Pb-Free  
6
5
Millimeter  
Millimeter  
Min. Max.  
0.100 REF.  
0.525 REF.  
0.08 0.15  
4
REF.  
REF.  
Min.  
Max.  
2.20  
2.45  
1.35  
1.10  
A
B
C
D
2.00  
2.15  
1.15  
0.90  
G
H
J
R1  
R2  
Q2  
K
8°  
E
F
1.20  
0.15  
1.40  
0.35  
L
0.650 TYP.  
R2  
R1  
Q1  
1
2
3
MAXIMUM RATINGS AND THERMAL CHARACTERISTICS  
(TA = 25°C unless otherwise noted, common for Q1 and Q 2, minus sign for Q1(PNP) omitted)  
PARAMETER  
Collector - Base Voltage  
SYMBOL  
VALUE  
50  
UNIT  
Vdc  
VCBO  
VCEO  
IC  
Collector - Emitter Voltage  
50  
Vdc  
Collector Currrent – Continuous  
100  
mAdc  
ONE JUNCTION HEATED THERMAL CHARACTERISTICS  
187(1)  
Total Device Dissipation, TA=25°C  
mW  
mW/°C  
°C/W  
256(2)  
PD  
1.5(1)  
Total Device Dissipation, Derate above 25°C  
Thermal Resistance, Junction to Ambient  
2.0(2)  
670(1)  
490(2)  
RθJA  
BOTH JUNCTION HEATED THERMAL CHARACTERISTICS  
250(1)  
Total Device Dissipation, TA=25°C  
mW  
mW/°C  
°C/W  
385(2)  
PD  
2.0(1)  
Total Device Dissipation, Derate above 25°C  
Thermal Resistance, Junction to Ambient  
Thermal Resistance, Junction to Lead  
3.0(2)  
493(1)  
325(2)  
188(1)  
208(2)  
-55~150  
RθJA  
RθJL  
°C/W  
°C  
Junction Temperature & Storage Temperature  
TJ,TSTG  
Note:  
1. FR-4 @ minimum pad  
2. FR-4 @ 1.0 x 1.0 inch pad  
18-Dec-2009 Rev. A  
Page 1 of 28  

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