是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | QFP | 包装说明: | QFF, QFL84,1.2SQ |
针数: | 84 | Reach Compliance Code: | compliant |
ECCN代码: | 3A001.A.2.C | HTS代码: | 8542.32.00.41 |
风险等级: | 5.45 | 最长访问时间: | 45 ns |
I/O 类型: | COMMON | JESD-30 代码: | S-XQFP-F84 |
JESD-609代码: | e0 | 长度: | 29.21 mm |
内存密度: | 131072 bit | 内存集成电路类型: | DUAL-PORT SRAM |
内存宽度: | 16 | 功能数量: | 1 |
端口数量: | 2 | 端子数量: | 84 |
字数: | 8192 words | 字数代码: | 8000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 8KX16 |
输出特性: | 3-STATE | 封装主体材料: | UNSPECIFIED |
封装代码: | QFF | 封装等效代码: | QFL84,1.2SQ |
封装形状: | SQUARE | 封装形式: | FLATPACK |
并行/串行: | PARALLEL | 峰值回流温度(摄氏度): | NOT SPECIFIED |
电源: | 5 V | 认证状态: | Not Qualified |
座面最大高度: | 2.89 mm | 最大待机电流: | 0.00002 A |
最小待机电流: | 2 V | 子类别: | SRAMs |
最大压摆率: | 0.26 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | FLAT | 端子节距: | 1.27 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 29.21 mm | Base Number Matches: | 1 |
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